With the development of integration technology and microelectronic packaging technology, the total power density of electronic components is increasing, while the physical dimensions of electronic components and electronic devices are gradually becoming smaller and miniaturized, and the generated heat is rapidly accumulated, leading to integration. The heat flux density around the device is also increasing, so the high-temperature environment will definitely affect the performance of electronic components and equipment, which requires a more efficient thermal control scheme. There are three general heat dissipation methods: heat conduction, convection, and radiation heat transfer.
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