The products of IC-Haus GmbH covers high-voltage, linear bipolar, high-density analog CMOS, and power BCD processes. Through optical technology, iC-Haus offers Photoelectric ASiCS: the integrated sensor monolithic system. Photoelectric and power chip assembly using standard plastic package, (soft) board chip technology and flip chip technology. Packaging can be customized according to customer requirements. In addition, the chip layout and circuit topology can be customized according to the individual needs of the customers and become iC-Haus's unique ASiC.