The products of IC-Haus GmbH covers high-voltage, linear bipolar, high-density analog CMOS, and power BCD processes. Through optical technology, iC-Haus offers Photoelectric ASiCS: the integrated sensor monolithic system. Photoelectric and power chip assembly using standard plastic package, (soft) board chip technology and flip chip technology. Packaging can be customized according to customer requirements. In addition, the chip layout and circuit topology can be customized according to the individual needs of the customers and become iC-Haus's unique ASiC.
The MAXM17532 and MAXM15462 ultra-small (2.6mm x 3.0mm x 1.5mm), integrated DC-DC power modules are part of Maxim's Himalayan power solution patent portfolio for the industrial, healthcare, communications and consumer markets. With these modules, customers can take full advantage of all the advantages of the industry's switching regulators, as well as the advantages of a small linear regulator (LDO) and easy design.
The emergence of new applications such as artificial intelligence and machine learning continues to drive the exponential growth of data center requirements for processing power and I/O bandwidth. The introduction of Marvell's new transceivers is specifically designed to address the upgrade of super-large data centers from 25 Gigabit Ethernet (GbE) and 100GbE to 50GbE, 200GbE and 400GbE. The 88X7120 uses 50G PAM4 signaling and supports 16 50GbE ports, 4 200GbE ports and 2 400GbE ports to meet the I/O speed requirements for very large-scale data centers.