Melexis Releases Chipset, Evaluation and Development Kit for ToF 3D Vision in a Challenging Environment

Melexis announced a chipset, evaluation and development kit that simplifies and accelerates the implementation of robust time-of-flight (ToF) 3D vision solutions for the most challenging environments. The chipset is a complete ToF sensor and control solution that supports QVGA resolution and offers unmatched daylight robustness and an operating temperature range of -40°C to +105°C. Designers can use the evaluation and development kit to test this automotive-ready chipset and start developing their own custom hardware and applications.
 
The Melexis chipset integrates the company's MLX75023 1/3-inch optical format ToF sensor with the MLX75123, a companion IC that controls the sensor and illumination unit and provides data to the host processor. Together, these devices minimize component count and reduce the size of 3D ToF cameras. The modular EVK75123 QVGA evaluation kit is designed for maximum flexibility - it combines a sensor board with the chipset, a lighting module, an interface board and a processor module.
 
The MLX75023 sensor features QVGA (320 x 240 pixels) resolution and industry-leading backlight suppression of up to 120klux. The IC delivers raw data output in less than 1.5ms, giving you unparalleled ability to track fast movements. The MLX75123 control chip features a 12-bit parallel camera interface and I2C connection, as well as four integrated high-speed analog-to-digital converters (ADCs). Integrated features include powerful diagnostics and support for regions of interest, configurable timing, image flipping, statistics, and modulation frequency.

Relevant MLX series products

Author：Brittany Antonia （The author of article owns the copyright.）