Unicem Semiconductor (Chengdu) IC Packaging & Test Co., Ltd. is the largest semiconductor packaging and test facility in Malaysia. Unisem Malaysia, headquartered in Kuala Lumpur, Malaysia, has manufacturing facilities in Ipoh, Malaysia, Wales, China, Chengdu, Indonesia and the United States. Unisem, Inc. is a leading provider of semiconductor packaging and testing services to the world's semiconductor companies to provide high-quality package testing services in wafer testing, chip bumps, wafer grinding, wide lead frame and IC Packaging and tape and reel, radio frequency, digital, analog, mixed-signal test expertise and expertise in the field of expertise and reputation.
An extensive product line of UNISEM is available at WIN SOURCE, especially for UNISEM’s obsolete & end-of-life electronic components. Find more product information, please view our online inventory below. (Quick search: Filter and Display capabilities are available.)