VIA Technologies, Inc. is the world's highly integrated embedded platform and system solutions leader, dedicated to M2M, the Internet of Things application development and smart city areas, ranging from the multi-screen wall, digital signage, industrial automation, medical automation. The company is headquartered in New Taipei City Xindian District Taiwan, VIA's global network through layout, high-tech core area in the United States, Europe and Asia set up branches.
An extensive product line of Via is available at WIN SOURCE, especially for Via’s obsolete & end-of-life electronic components. Find more product information, please view our online inventory below. (Quick search: Filter and Display capabilities are available.)
TDK Corporation (Tokyo Stock Exchange: 6762) Introduced CeraLink FA type capacitors with modular flexible assembly technology to further expand the lineup of proven CeraLinkTM capacitors. The new type of capacitor has a space-saving design with two, three or even ten identical capacitors connected in parallel on the same terminal to increase the capacitance.
STMicroelectronics' two new microcontroller product lines enhance the energy efficiency, functional integration and design flexibility of the STM32F4 basic product line high-end products to meet the technical requirements of high-performance embedded design. These STM32's latest microcontrollers operate at temperatures up to 125 ° C , featuring always-on sensors and general industrial equipment, providing a robust, reliable and cost-effective system upgrade for STM32F1 applications .