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XC7Z045-1FFG900I

Part No :
XC7Z045-1FFG900I
Manufacturer :
Catalog :
Embedded - System On Chip(SoC)
Description :
IC SOC CORTEX-A9 KINTEX7 900FBGA
Rohs State :
Need to verify
Rated 5/5 based on 1 customer reviews
Shipped from :
HK warehouse
Expected Shipping Date :
Ship today if order in (HKT)
Supplier Lead-Time :
Quantity
Price
Ext. Price
1+
€395.668
€381.028
* The above prices does not include taxes and freight rates, which will be calculated on the order pages.
Availability (In-stock): 300 pieces can ship immediately
Order Increment : 1 pcs
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Products specifications
Categories Integrated Circuits (ICs)
Manufacturer Xilinx Inc.
Series Zynq-7000
Packaging Tray
Architecture MCU, FPGA
Core Processor Dual ARM Cortex-A9 MPCore with CoreSight
MCU RAM 256KB
Peripherals DMA
Connectivity CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 667MHz
Primary Attributes Kintex-7 FPGA, 350K Logic Cells
Operating Temperature Range -40°C ~ 100°C (TJ)
Package 900-BBGA, FCBGA
Manufacturer Package 900-FCBGA (31x31)
Number of I/O 130
RoHS State Request Verification
Win Source Part Number 758293-XC7Z045-1FFG900I
Popularity Medium
Fake Threat In the Open Market 71 pct.
Supply and Demand Status Limited
Family Name XC7Z045
Introduction Date March 23, 2012
Country of Origin Republic of Korea, Taiwan
Estimated EOL Date 2024
Alternative Parts
(Cross-Reference)
XC7Z045-1FFG676I;  XC7Z045-1FFG900C; 
Xilinx Inc. XC7Z045-1FFG900I is available at WIN SOURCE. Please review product page below for detailed information, including XC7Z045-1FFG900I price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for XC7Z045-1FFG900I to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.
Products specifications
ECAD Module
Categories Integrated Circuits (ICs)
Manufacturer Xilinx Inc.
Series Zynq-7000
Packaging Tray
Architecture MCU, FPGA
Core Processor Dual ARM Cortex-A9 MPCore with CoreSight
MCU RAM 256KB
Peripherals DMA
Connectivity CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 667MHz
Primary Attributes Kintex-7 FPGA, 350K Logic Cells
Operating Temperature Range -40°C ~ 100°C (TJ)
Package 900-BBGA, FCBGA
Manufacturer Package 900-FCBGA (31x31)
Number of I/O 130
RoHS State Request Verification
Win Source Part Number 758293-XC7Z045-1FFG900I
Popularity Medium
Fake Threat In the Open Market 71 pct.
Supply and Demand Status Limited
Family Name XC7Z045
Introduction Date March 23, 2012
Country of Origin Republic of Korea, Taiwan
Estimated EOL Date 2024
Alternative Parts
(Cross-Reference)
XC7Z045-1FFG676I;  XC7Z045-1FFG900C; 
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XC7Z045-1FFG900I Embedded - System On Chip(SoC)

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