Huajing Branch will release the latest 3D sensing depth chip at CES

International Consumer Electronics Show CES exhibition on January 9 in Las Vegas, USA, Taiwan's digital imaging program expert Hua Jingke will be released at the CES show the latest depth of 3D sensing chip AL6100, hoping to borrow By the world's largest science and technology exhibition so that the world see Hua Jingke's technical strength and products.

Huajing Branch said that in 2016 Huacink launched the first generation of depth computing chip AL 3200, displaying frames per second up to 30 fps, to achieve real-time depth operation (real-time depth), and was adopted by a number of mainland mobile phone manufacturers, so far Volume has more than tens of millions. A new generation of 3D sensing depth chip AL 6100 combined with infrared light control, greatly enhance the image quality and instruction cycle depth information, and can be used in more real-time computing products such as: mobile phones, security control, automatic driving, smart home assistant , Drones, sweeping robots, etc., are expected to enter mass production in the first quarter of this year and may begin to supply. The CES show, Huajing Branch will show AL6100 in mobile phones, security control, VR / AR cameras and other products on the use of security cameras which are more artificial intelligence depth learning ability, showing excellent under a variety of environments and light Humanoid recognition for distributed intelligent network edge devices increases privacy and reduces the need for network bandwidth. In the AR / VR application, real-time depth calculation can realize real-time perception of facial expressions, body gestures and gestures of the surrounding environment and people.

Huajingke transformed from early digital camera ODM plant to digital imaging solution provider. Since 2012, Huajingke has been investing in deep computing algorithm technology for over 6 years so far. It has many patents in Taiwan, China, and the United States. In 2014, it helped HTC to build the No.1 in the world Support dual-lens mobile phone M8, can be said that the depth of the ancestor of the domestic operations, the depth of its imaging operations and chip technology has also won the mainland mobile phone manufacturers and the United States Department of semiconductor manufacturers and other customers favor and affirmation.

In the face of the AI ​​artificial intelligence era, Huajingke said it is further developing chips with deep learning and has completed the FPGA version. In the future, the video chip will not only be able to handle the image quality of photos and videos, but also real-time identification will be more For strength. With core imaging technology in the era of 3D sensing and artificial intelligence, Huachen has great confidence in its future competitive advantages.

Author：Brittany Antonia （The author of article owns the copyright.）