The 48th Weekly
Industry News Digest
From November 22nd to November 28th, 2024
TSMC is reportedly slowing down the expansion of its CoWoS (Chip-on-Wafer-on-Substrate) packaging technology for 2026 due to……
##CoWoS #Melexis #NXP #Chip Grant #Ultracapacitors #IO-Link #Railways #PCB Industry #Netgear #Surecore
The 47th Weekly
Industry News Digest
From November 15th to November 21st, 2024
NXP's i.MX 94 family of processors integrates communications, security and real-time control for industrial and in-vehicle applications……
##NXP #TSMC #Silicon Photonics #Nvidia #LoRaWAN #Quantinuum #Inductors #PROFET #Processor #DDR4
The 46th Weekly
Industry News Digest
From November 8th to November 14th, 2024
Major expansions by leading semiconductor companies TSMC, Samsung and Intel are critical to meeting the growing global demand for more.……
## Fabs #Marelli #Motor Control #Melexis #Switcher IC #Edge AI #Renesas #Frankfurt #Virtual Design #SK Hynix