ST10F269-Q3 Microcontroller from STMicroelectronics

The ST10F269-Q3 is a high-performance microcontroller produced by STMicroelectronics, designed to cater to the demanding needs of automotive and industrial applications. This microcontroller is part of the ST10 family, which is renowned for its robust architecture, high computing power, and versatile features.

Key Features

• CPU Core: The ST10F269-Q3 is built around the ST10 core, a 16-bit CPU with a 5-stage pipeline and an integrated macrocell for improved performance. It operates at a frequency of up to 40 MHz, delivering the computational power necessary for complex tasks.
• Memory: It boasts a substantial memory capacity with 256 KB of on-chip Flash memory, which is both fast and reliable, and 12 KB of dual-port RAM, facilitating efficient data handling and storage.
• Peripherals: This microcontroller comes with a rich set of peripherals, including multiple 16-bit timers, a 10-bit analog-to-digital converter (ADC) with 16 channels, and a synchronous/asynchronous serial communication interface.
• CAN Interface: It has an on-chip Controller Area Network (CAN) interface, enabling robust communication in automotive networks and industrial control systems.
• Temperature Range: The device is designed to operate over an extended temperature range, making it suitable for harsh environments.
• Package: The ST10F269-Q3 is available in a QFP144 package, providing a compact footprint for space-constrained applications.

Applications

The ST10F269-Q3 microcontroller is ideal for a wide range of applications, particularly in the automotive sector, where it can be used for engine management systems, transmission control, body control modules, and safety systems. Its robustness and reliability also make it a suitable choice for industrial automation, robotics, and other applications that require high-speed processing and real-time control.

Conclusion

In summary, the ST10F269-Q3 from STMicroelectronics is a feature-rich, high-performance microcontroller that offers a balanced combination of processing power, memory capacity, and peripheral integration. Its resilience to extreme conditions and its comprehensive feature set make it a go-to solution for engineers looking to develop advanced automotive and industrial systems.