Vishay Introduces Industry's First TMBS Rectifier Family in MicroSMP Package

The A and 2A devices have a height of 0.65 mm and a forward voltage drop of 0.36V. Significant space savings and increased power density and efficiency

Recently, Vishay Intertechnology, Inc. announced the addition of 10 1A and 2A devices in the eSMP® series MicroSMP (DO-219AD) package to expand its surface mount TMBS® Trench MOS barrier Schottky rectifier. Vishay General Semiconductor's new rectifier saves space and replaces the Schottky rectifier in the SOD123W package with reverse voltages from 45V to 150V. The industry's first 2A TMBS rectifier in the MicroSMP package reduces the forward voltage to 0.40V.

Currently, 2A current Schottky rectifiers are typically packaged in SOD123W and SMA. The devices released today also output high forward currents in a smaller MicroSMP package, increasing power density. The size of the rectifier is 2.5mm x 1.3mm and the height is 0.65mm, which is 35% thinner than SOD123W and 45% less board space. For good thermal performance, the MicroSMP package features an asymmetrical lead frame design.

The forward voltage drop of the 1A rectifier is 0.36V, and the forward voltage drop of the 2A device is 0.40V, which reduces power loss and improves efficiency. For industrial and commercial applications such as low voltage high frequency inverters, DC/DC converters, freewheeling and polarity protection. These devices are also available in AEC-Q101 certified versions for automotive applications.

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Author：Brittany Antonia （The author of article owns the copyright.）