ON Semiconductor's Low-Light-Level Imaging SoC Reduction Solution for Automotive Camera Applications

AEC-Q1000-Compliant, Fully Integrated, 1-Megapixel CMOS Sensor Provides a Better Choice than Component Sensors and Image Signal Processors

ON Semiconductor, which promotes energy-efficient innovation, has introduced two new highly-integrated one-megapixel (Mp) CMOS image sensing products to advance the company's significant progress in the rapidly growing field of automotive imaging. The new device provides a complete solution that integrates image sensor and processing functions in a low-power system-on-a-chip (SoC) to simplify and accelerate adoption in applications such as rear view and look-around cameras. Compared with the traditional solution consisting of discrete sensors and processors, its PCB space has been reduced by more than 30%. This assists designers in implementing camera solutions without affecting the shape and aesthetics of the car.

The number of cameras used in passenger vehicles and other image sensing technologies continues to grow rapidly. Industry analysts predict that by 2020, annual shipments of cameras in the automotive industry will easily exceed 80 million units. Sensors are an application area that promotes the development of fully automatic driving; at the same time, imaging devices such as the AS0140 and AS0142 can continuously expand the lineup of advanced driver assistance systems (ADAS), bringing more comfort and convenience to the driver. And security. The integrated sensor provides an easy-to-implement solution for the car designer, giving the driver a comprehensive and clear view of the ring.

Both the AS0140 and AS0142 devices are 1/4-inch and can support 45 fps throughput at full resolution or 60 fps at 720p resolution. The main functions include distortion correction and multicolor overlay, and both analog (NTSC) and digital (Ethernet) interfaces. Both SoC devices use Adaptive Local Tone Mapping (ALTM) to eliminate artifacts during acquisition and improve image quality. The 93 dB dynamic range enables these two new devices to work effectively in high-light and low-light applications. Both the AS0140 and AS0142 provide multi-camera synchronization support, which will increase the value for automotive design engineers as the number of on-board cameras increases.

Ross Jatou, vice president and general manager of ON Semiconductor's automotive imaging solutions division, said: "These two devices provide engineers with a complete SoC camera solution that combines the advantages of low-power operation and higher dynamic range. The reduction in PCB size and total material cost means that the two devices meet the strict imaging requirements of automotive manufacturers in both logic and performance.At present, most of the solutions are still low-efficiency discrete and use separate image sensors. And image processors or SoCs with limited functionality."

The power efficiency of these two new devices is the best in their class; when operating at 30 fps in high dynamic range (HDR) mode, the power consumption is only 530 milliwatts (mW). The operating temperature range is -40°C to +105°C, making it ideal for automotive environments. Engineering samples are available now. The AS0140 will be put into production in the fourth quarter of 2017, and the AS0142 will be put into production in the first quarter of 2018.

Author：Brittany Antonia （The author of article owns the copyright.）