XCZU4EV-2FBVB900E Real Image
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Category Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Mfr AMD Xilinx
Series Zynq® UltraScale+™ MPSoC EV
Package Tray
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 600MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Temperature Range - Operating 0°C ~ 100°C (TJ)
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
Number of I/O 204
Base Product Number XCZU4
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 5A002A4 XIL
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 1014496-XCZU4EV-2FBVB900E
Ultra Librarian 3D Model Ultra Librarian XCZU4EV-2FBVB900E CAD Model

Description

The XCZU4EV-2FBVB900E is an integrated circuit (IC) from AMD Xilinx. It is a Zynq® UltraScale+™ MPSoC EV series with quad ARM® Cortex®-A53 MPCore™ with CoreSight™, dual ARM® Cortex™-R5 with CoreSight™, and ARM Mali™-400 MP2.

  • Speed: 533MHz to 1.3GHz
  • Package: Tray
  • Standard Package: 1
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG
  • Peripherals: DMA and WDT
  • I/O: 204
  • RAM Size: 256KB
  • Flash Size: No flash size
  • Architecture: MCU, FPGA
  • Primary Attributes: Zynq® UltraScale+™ FPGA, 192K+ logic cells
  • Package/Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
  • Temperature Range: 0°C to 100°C (TJ)
  • ECCN: 5A002A4 XIL
  • REACH: REACH unaffected
  • HTSUS: 8542.39.0001

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Pricing & Ordering

Quantity Unit Price Ext. Price
1+ $390.7758 $390.7758
2+ $350.3509 $700.7018
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
Availability: 510 pieces
Order Increment : 1 piece
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