XCZU4EV-2FBVB900I Real Image
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Category Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Mfr AMD Xilinx
Series Zynq® UltraScale+™ MPSoC EV
Package Tray
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 600MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Temperature Range - Operating -40°C ~ 100°C (TJ)
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
Number of I/O 204
Base Product Number XCZU4
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 5A002A4 XIL
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 1204195-XCZU4EV-2FBVB900I
Ultra Librarian 3D Model Ultra Librarian XCZU4EV-2FBVB900I CAD Model

Description

This electronic component is an integrated circuit with the Win Source Part Number 1204195-XCZU4EV-2FBVB900I.

  • Category: Embedded System on Chip (SoC)
  • Series: Zynq UltraScale+ MPSoC EV
  • Processor Core: Quad ARM Cortex-A53 MPCore with CoreSight, dual ARM Cortex-R5 with CoreSight, and ARM Mali-400 MP2
  • Processor Speed: 533MHz, 600MHz, and 1.3GHz
  • Package: Tray
  • Standard Package: 1
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG
  • Peripherals: DMA and WDT
  • Input/Output Pins: 204
  • RAM Size: 256KB
  • Architecture: MCU and FPGA
  • Primary Attribute: Zynq UltraScale+ FPGA, 192K+ logic cells
  • Package/Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
  • Operating Temperature: -40°C to 100°C (TJ)

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