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Category Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Mfr AMD Xilinx
Series Zynq® UltraScale+™ MPSoC EV
Package Tray
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 600MHz, 1.5GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Temperature Range - Operating 0°C ~ 100°C (TJ)
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
Number of I/O 204
Base Product Number XCZU4
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 5A002A4 XIL
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 1012974-XCZU4EV-3FBVB900E
Ultra Librarian 3D Model Ultra Librarian XCZU4EV-3FBVB900E CAD Model

Description

The AMD Xilinx XCZU4EV-3FBVB900E is an embedded system on chip (SoC) with a quad ARM Cortex-A53 MPCore with CoreSight and dual ARM Cortex-R5 with CoreSight processors.

  • Product: XCZU4EV-3FBVB900E
  • Manufacturer: AMD Xilinx
  • Type: Embedded System on Chip (SoC)
  • Processors: Quad ARM Cortex-A53 MPCore with CoreSight and Dual ARM Cortex-R5 with CoreSight
  • Speed: 600MHz and 1.5GHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Peripherals: DMA and WDT
  • RAM Size: 256KB

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