TRENCHSTOPTM Advanced Isolation Package for Single Tube IGBTs

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduced TRENCHSTOPTM Advanced Isolation, a new packaging technology. TRENCHSTOPTM Advanced Isolation can be used with TRENCHSTOP and TRENCHSTOP Highspeed 3 IGBTs to ensure best-in-class thermal performance and simplify the manufacturing process. Both versions have been optimized to replace FullPAK and standard and high-performance insulation foils.

The new package is suitable for many applications such as air conditioning power factor correction (PFC), uninterruptible power supply (UPS) and frequency converters.

Common insulation options, like FullPAK or standard TO packages with insulating materials, are expensive and difficult to process. In addition, they are insufficient to meet the heat dissipation requirements of the latest high power density IGBTs. TRENCHSTOPTM Advanced Isolation has the same dimensions as the standard TO-247 package but is 100% insulated. However, there is no need to use insulating foil or thermal grease. Thanks to an efficient and reliable heat dissipation path from the IGBT wafer to the heat sink, the new package offers greater power density. It improves reliability and reduces system and manufacturing costs.

By eliminating the need for insulating materials and thermal grease, designers can reduce assembly time by up to 35%. At the same time, it improves reliability by eliminating misaligned foils. The new package's thermal resistance (Rth) is 50% lower than that of the TO-247 FullPak and 35% lower than the standard TO-247 with insulating foil. These improvements translate into improved performance, with a 10°C lower operating temperature compared to the FullPak package. Using the TRENCHSTOPTM Advanced Isolation package increases system efficiency by 0.2% compared to the standard TO-247 with insulating foil.

In addition, the package has a low coupling capacitance of only 38 pF, which means better anti-electromagnetic interference (EMI) performance and it is possible to use smaller filters. Improved heat dissipation also helps improve reliability because IGBTs can operate at lower temperatures, which can relieve stress on the components. Lower operating temperatures can also reduce the size of the heatsink components, which helps save system costs. In addition, designers can also choose higher design margins to achieve higher power density due to lower heat dissipation requirements.

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Author：Brittany Antonia （The author of article owns the copyright.）