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H5TQ4G43CMR-H9C

Part No H5TQ4G43CMR-H9C
Manufacturer Hynix Semiconductor
Catalog DDR
Description DDR3-1333 1Gx4 (4Gb)
Sample
Rohs State rohs
ECAD Module
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Categories Memory
Win Source Part Number 940682-H5TQ4G43CMR-H9C
Series *
Ultra Librarian 3D Model Ultra Librarian H5TQ4G43CMR-H9C CAD Model

Description

The H5TQ4G43CMR-H9C is a DDR3 SDRAM (Synchronous Dynamic Random-Access Memory) chip manufactured by Hynix Semiconductor. It is designed for high-performance memory applications requiring substantial bandwidth and low power consumption. The H9C likely denotes a specific speed grade or timing characteristic.

Applications:

  • Desktop computers
  • Laptop computers
  • Gaming consoles
  • Networking equipment (routers, switches)
  • High-performance computing

Features:

  • DDR3 Technology: Utilizes the DDR3 architecture, offering improved speed and efficiency compared to previous DDR generations.
  • 4Gb Density: Features a memory density of 4 Gigabits (512MB).
  • Operating Speed: Supports data transfer rates up to 1600 MT/s (Mega Transfers per second), depending on system configuration and the specific grade.
  • Low Voltage: Operates at a standard 1.5V, reducing power consumption and heat generation.
  • FBGA Package: Uses a Fine-pitch Ball Grid Array (FBGA) package for efficient surface mounting and thermal dissipation.
  • RoHS Compliance: Compliant with the RoHS (Restriction of Hazardous Substances) directive.

Benefits:

  • Increased Bandwidth: Offers high bandwidth for demanding applications, resulting in improved system responsiveness and performance.
  • Reduced Power Consumption: Low voltage operation minimizes power consumption, extending battery life in portable devices and reducing energy costs.
  • Enhanced Performance: Improves overall system performance by enabling faster memory access and data transfer.
  • Reliable Operation: Manufactured by Hynix, a leading memory manufacturer, ensuring high reliability and quality.
  • Cost-Effective Solution: Provides a balance of performance and cost, making it suitable for a wide range of applications.

Additional Details:

The H5TQ4G43CMR-H9C is internally organized into banks, allowing for concurrent memory access and improved efficiency. It incorporates features like auto refresh, self refresh, and power-down modes to optimize power management. For detailed specifications, including timing parameters and operating temperature ranges, refer to the Hynix Semiconductor datasheet for this specific part number. This chip is designed for stable and reliable operation in demanding computing environments.

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