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Same model may have multiple batches, images only for reference.
BCM33838MKFEBG
Same model may have multiple batches, images only for reference.

BCM33838MKFEBG

Part No BCM33838MKFEBG
Manufacturer Broadcom Limited
Catalog Embedded - System On Chip (SoC)
Description MODEM DOCSIS 3.0 8X4
Sample
Rohs State Need to verify
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Mfr Broadcom Limited
Package Tray
Product Status Obsolete
Standard Package 1 pcs
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN OBSOLETE
HTSUS 0000.00.0000
Win Source Part Number 863679-BCM33838MKFEBG
Ultra Librarian 3D Model Ultra Librarian BCM33838MKFEBG CAD Model

Description

The BCM33838MKFEBG is an embedded system-on-chip (SoC) designed by Broadcom Limited. It falls under the category of integrated circuits (ICs) and is commonly used in electronic devices.

  • Package: Tray
  • Standard Package: 1 piece
  • Status: Obsolete
  • Market Share: 70%
  • MSL Level: 1
  • HTSUS Code: 0000.00.0000
  • Manufacturer: Broadcom Limited

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Pricing & Ordering

Quantity Unit Price Ext. Price
2+ $31.2820 $62.5640
5+ $25.6676 $128.3380
7+ $24.8648 $174.0536
10+ $24.0633 $240.6330
13+ $23.2605 $302.3865
17+ $20.8547 $354.5299
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
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Availability: 190 pieces
MOQ: 2 pcs
Order Increment : 1 pcs
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