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H5TC2G83BFR-PBA

Part No H5TC2G83BFR-PBA
Manufacturer Hynix Semiconductor
Catalog DDR
Description DDR3-1600 256Mx8 (2Gb) 1.35V
Sample
Rohs State rohs
ECAD Module
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Categories Memory
Win Source Part Number 941101-H5TC2G83BFR-PBA
Series *
Ultra Librarian 3D Model Ultra Librarian H5TC2G83BFR-PBA CAD Model

Description

The Hynix H5TC2G83BFR-PBA is a 2Gb (Gigabit) DDR3 SDRAM (Double Data Rate 3 Synchronous Dynamic Random-Access Memory) chip manufactured by Hynix Semiconductor. This component is designed for applications requiring high memory bandwidth and improved power efficiency compared to previous DDR generations. The 'PBA' likely signifies a specific speed grade, temperature range or other operational characteristics within the DDR3 specification.

Applications:

  • Desktop and laptop computers
  • Gaming consoles
  • Networking equipment (routers, switches, etc.)
  • Smart TVs and media players
  • Embedded systems with demanding memory requirements

Features:

  • Capacity: 2Gb (Gigabit)
  • Organization: Typically 256M x 8 or 128M x 16 (consult the datasheet for exact configuration)
  • Interface: DDR3
  • Data Rate: High-speed data transfer (specific rate is determined by 'PBA' speed grade)
  • Voltage: Typically operates at 1.5V for reduced power consumption
  • Package: FBGA (Fine-Pitch Ball Grid Array) for compact size and efficient PCB mounting
  • Clock Frequency: Optimized for DDR3 operation and the specific speed grade

Benefits:

  • High Bandwidth: Enables faster data transfer rates, significantly improving system performance compared to DDR2
  • Low Power Consumption: Reduces energy usage, making it suitable for battery-powered devices and energy-efficient systems
  • Increased System Responsiveness: Faster memory access reduces latency and enhances overall system speed
  • Compact Footprint: FBGA package saves valuable board space
  • Reliable Performance: Designed for stable and reliable operation in various environments

Additional Details:

The H5TC2G83BFR-PBA conforms to JEDEC standards for DDR3 SDRAM. The 'PBA' marking indicates the specific speed bin and timing characteristics. DDR3 memory achieves higher data transfer rates by utilizing an 8-bit prefetch buffer and operating at higher clock frequencies. The FBGA package provides excellent thermal performance and simplifies PCB assembly. Consult the official Hynix datasheet for detailed timing parameters, voltage specifications, and other relevant technical information.

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