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10M04DAF256C8G

Part No 10M04DAF256C8G
Manufacturer Intel
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs)>Embedded - FPGAs (Field Programmable Gate Array)
Mfr Intel
Series MAX® 10
Package Tray
Number of LABs/CLBs 250
Number of Logic Elements/Cells 4000
Total RAM Bits 193536
Number of I/O 178
Voltage - Supply 1.15V ~ 1.25V
Mounting SMD (SMT)
Temperature Range - Operating 0°C ~ 85°C (TJ)
Package / Case 256-LBGA
Supplier Device Package 256-FBGA (17x17)
Other Names 544-3048,967127
Standard Package 90
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Win Source Part Number 1265066-10M04DAF256C8G
Ultra Librarian 3D Model Ultra Librarian 10M04DAF256C8G CAD Model

Description

The 10M04DAF256C8G is a member of the MAX 10 family of Field Programmable Gate Arrays (FPGAs) from Intel. This device offers a cost-effective and power-efficient solution for a wide range of applications, combining flash memory, analog-to-digital converters (ADCs), and other hard IP blocks on a single chip. The F256 package indicates the device's packaging, and the C8 signifies its temperature grade and speed grade.

Applications

  • Motor Control
  • Industrial Automation
  • Power Management
  • Sensor Interface
  • Embedded Vision
  • System Management

Features

  • Integrated Flash Memory: Provides on-chip storage for configuration data and user data, eliminating the need for external memory devices.
  • Analog-to-Digital Converters (ADCs): Integrated ADCs enable direct interface with analog sensors and signals.
  • Instant-on Capability: Fast configuration time enables immediate operation upon power-up.
  • Nios II Embedded Processor Support: Enables the implementation of soft-core processors for embedded processing tasks.
  • Extensive I/O Options: Provides a variety of I/O interfaces to connect with external devices and systems.
  • Advanced Security Features: Protects against unauthorized access and tampering.

Benefits

  • Reduced System Cost: Integration of multiple functions on a single chip lowers component count and board space requirements.
  • Improved Power Efficiency: Low power consumption makes it suitable for battery-powered and energy-sensitive applications.
  • Faster Time-to-Market: Pre-designed IP blocks and development tools accelerate the design process.
  • Enhanced System Reliability: Integrated flash memory and security features improve system robustness.
  • Greater Design Flexibility: Programmable logic enables customization and adaptation to specific application needs.
  • Simplified System Design: Integrated ADCs and other hard IP blocks streamline system design and reduce complexity.

Additional Details

The 10M04DAF256C8G features 4,000 logic elements (LEs), providing ample resources for implementing complex digital circuits. It operates over a wide voltage range and is available in various temperature grades to suit different environmental conditions. Intel provides comprehensive development tools and IP cores to support the design and implementation of applications using the MAX 10 FPGA family. The device's integrated flash memory can also be used for storing user data, such as calibration parameters or configuration settings. The MAX 10 family is known for its robust architecture and high reliability, making it a popular choice for industrial and automotive applications.

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Pricing & Ordering

Quantity Unit Price Ext. Price
1+ $58.6467 $58.6467
3+ $48.1204 $144.3612
4+ $46.6166 $186.4664
5+ $45.1128 $225.5640
6+ $43.6091 $261.6546
8+ $39.0978 $312.7824
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
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Availability: 6,480 pieces
Order Increment : 1 pcs
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