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MT9HTF6472PKY-53ED3

Part No MT9HTF6472PKY-53ED3
Manufacturer Micron Technology Inc.
Catalog Memory - Modules
Description DDR2-667 64Mx72 ECC
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Categories Memory - Modules
Win Source Part Number 950757-MT9HTF6472PKY-53ED3
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Ultra Librarian 3D Model Ultra Librarian MT9HTF6472PKY-53ED3 CAD Model

Description

The Micron MT9HTF6472PKY-53ED3 is a 512MB DDR2 ECC Fully Buffered DIMM (FBDIMM). Designed primarily for high-end servers and workstations, FBDIMMs offer improved memory bandwidth and capacity compared to traditional registered DIMMs, making them suitable for demanding applications.

Applications

  • High-performance servers
  • Advanced workstations
  • Data centers
  • Scientific computing

Features

  • 512MB capacity
  • DDR2 technology
  • ECC (Error-Correcting Code) for data integrity
  • Fully Buffered DIMM (FBDIMM) architecture
  • PC2-5300F (667MHz) speed
  • 240-Pin DIMM

Benefits

  • Enhanced Memory Bandwidth: FBDIMM architecture eliminates the parallel data bus bottleneck, significantly increasing memory bandwidth compared to registered DIMMs.
  • Improved Scalability: FBDIMMs allow for larger memory capacities and more DIMMs per channel without significant performance degradation.
  • Superior Data Integrity: ECC functionality corrects single-bit errors, ensuring data accuracy and preventing system instability.
  • Increased System Performance: Higher memory bandwidth translates to faster data access and improved overall system performance, particularly in memory-intensive applications.
  • Reliable Operation: Designed for continuous operation in demanding server environments.

Technical Specifications

The MT9HTF6472PKY-53ED3 operates at 1.8V and is compliant with industry standards for DDR2 FBDIMMs. FBDIMMs utilize an Advanced Memory Buffer (AMB) chip on each module to manage data transfer and error correction. This memory module is critical for applications that require high memory bandwidth and capacity, such as database servers, virtualization platforms, and scientific simulations. The fully buffered design ensures that the memory subsystem can handle large amounts of data efficiently, contributing to increased system throughput and responsiveness. Its 512MB capacity provides ample memory for various workloads. The use of ECC ensures that data errors are detected and corrected, preventing data corruption and system crashes. The module is designed for reliable and stable operation in demanding server environments.

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