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A3P600L-FGG144I

Part No A3P600L-FGG144I
Manufacturer Microsemi Corporation
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 97 I/O 144FBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Manufacturer Microsemi Corporation
Packaging Tray
Total RAM Bits 110592
Number of I/O 97
Number of Gates 600000
Supply Voltage (V) 1.14V ~ 1.575V
Mounting Style SMD
Temperature Range - Operating -40°C ~ 100°C
Manufacturer Package 144-LBGA
Supplier Device Package 144-FPBGA (13x13)
Part Number Series A3P600L
Manufacturer Pack Quantity 1
MSL Level 3 (168 Hours)
Popularity Low
Supply and Demand Status Limited
Win Source Part Number 812794-A3P600L-FGG144I
Ultra Librarian 3D Model Ultra Librarian A3P600L-FGG144I CAD Model

Description

The A3P600L-FGG144I is a member of the ProASIC3L family of Field Programmable Gate Arrays (FPGAs) from Microsemi Corporation. This FPGA offers a compelling combination of low power consumption, high performance, and robust security features, making it suitable for a wide range of applications.

Applications

  • Industrial Control Systems: Used for implementing custom control logic, data acquisition, and motor control.
  • Networking Equipment: Employed in routers, switches, and other networking devices for packet processing, traffic management, and protocol conversion.
  • Automotive Systems: Found in advanced driver-assistance systems (ADAS), infotainment systems, and engine control units (ECUs).
  • Medical Devices: Utilized in medical imaging equipment, patient monitoring systems, and diagnostic tools.
  • Aerospace and Defense: Implemented in avionics systems, radar systems, and communication systems due to its reliability and security features.

Features

  • 600,000 System Gates: Provides ample logic capacity for complex designs.
  • 108 User I/Os: Offers a large number of input/output pins for interfacing with external devices.
  • Low Power Consumption: Minimizes power consumption, making it suitable for battery-powered applications.
  • Flash-Based Configuration: Uses flash memory for configuration storage, eliminating the need for external configuration devices.
  • Security Features: Includes advanced security features to protect against tampering and reverse engineering.
  • Advanced Packaging: Available in a 144-pin Fine-Pitch Ball Grid Array (FGG) package for efficient board layout.
  • Operating Temperature Range: Industrial temperature range ensures reliable operation in harsh environments.

Benefits

  • Design Flexibility: Allows designers to implement custom logic and algorithms tailored to their specific application requirements.
  • Fast Time-to-Market: Enables rapid prototyping and development, reducing time-to-market.
  • Reduced System Cost: Eliminates the need for external configuration devices, reducing system cost.
  • Enhanced Security: Protects against unauthorized access and modification of the design.
  • Improved Performance: Delivers high performance for demanding applications.
  • Lower Power Consumption: Extends battery life in portable applications.

Additional Details

The A3P600L-FGG144I operates over an industrial temperature range of -40°C to +85°C. It supports a wide range of I/O standards, including LVTTL, LVCMOS, and PCI. The device is programmed using Microsemi's Libero Integrated Design Environment (IDE), which provides a comprehensive set of tools for design entry, simulation, and implementation. It is packaged in a 144-pin FGG package with a 1.0mm ball pitch. Core voltage is typically 1.5V. The device is RoHS compliant.

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Pricing & Ordering

Quantity Unit Price Ext. Price
1+ $134.3284 $134.3284
2+ $129.8508 $259.7016
3+ $116.4180 $349.2540
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Availability: 1,810 pieces
Order Increment : 1 pcs
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