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XC2VP20-5FFG896I

Part No XC2VP20-5FFG896I
Manufacturer Xilinx Inc.
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 556 I/O 896FCBGA
Datasheet
Sample
Rohs State rohs
ECAD Module
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Categories Integrated Circuits (ICs)
Features series Field Programmable Gate Array (FPGA) IC 556 1622016 20880 896-BBGA, FCBGA
Manufacturer Xilinx Inc.
Series Virtex®-II Pro
Package Tray
Part Status Obsolete
Number of I/O 556
Operating Temperature Range -40°C ~ 100°C (TJ)
Mounting Surface Mount
Package 896-BBGA, FCBGA
Case / Package 896-FCBGA (31x31)
Family Name XC2VP20
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 3A001A7A
HTSUS 8542.39.0001
Quantity per package 1
Popularity High
Supply and Demand Status Balance
Win Source Part Number 939265-XC2VP20-5FFG896I
Ultra Librarian 3D Model Ultra Librarian XC2VP20-5FFG896I CAD Model

Description

The XC2VP20-5FFG896I is a Virtex-II Pro series FPGA from Xilinx. This FPGA integrates both FPGA fabric and PowerPC processor cores, providing a versatile platform for embedded systems development. The 'FFG896' designates a Flip-Chip Fine-Pitch Ball Grid Array package with 896 pins. The 'I' indicates it is rated for the industrial temperature range.

Applications:

  • Embedded Systems: Used in industrial controllers, automotive systems, and aerospace applications where both programmable logic and processing capabilities are required.
  • Communication Systems: Implemented in wireless base stations, network routers, and satellite communication systems for signal processing and control.
  • Image and Video Processing: Employed in video surveillance systems, medical imaging equipment, and broadcast video processing for real-time image analysis and manipulation.
  • Industrial Automation: Utilized in robotic control systems, machine vision systems, and process automation equipment for data acquisition, control, and communication.
  • Aerospace and Defense: Integrated into radar systems, electronic warfare systems, and guidance systems for high-performance processing and control.

Features:

  • Integrated PowerPC Processors: Provides embedded PowerPC processor cores for real-time processing and control applications.
  • High Logic Density: Offers a large number of programmable logic resources for implementing custom digital circuits.
  • Embedded Memory: Includes on-chip block RAM and distributed RAM for high-speed data storage and retrieval.
  • High-Speed Serial Interfaces: Integrates RocketIO multi-gigabit transceivers for high-bandwidth serial communication.
  • Flexible I/O: Supports a wide range of I/O standards and protocols, enabling seamless connectivity to external devices.

Benefits:

  • System Integration: Combines processor and FPGA functionality on a single chip, reducing board space and system cost.
  • High Performance: Delivers high-speed processing and flexible logic implementation for demanding applications.
  • Rapid Development: Enables fast prototyping and development of embedded systems.
  • Power Efficiency: Optimizes power consumption through advanced power management techniques.
  • Design Flexibility: Allows for customization and adaptation to specific application requirements.

Additional Details:

The XC2VP20-5FFG896I contains 2,338,560 system gates. It has two embedded PowerPC cores. The FPGA fabric contains 19,520 logic cells. The available distributed RAM is 1,123,968 bits. This device offers 556 available I/O pins. The core voltage for the FPGA fabric is 1.5V, and the processor core voltage is 1.8V. The speed grade is -5.

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Pricing & Ordering

Quantity Unit Price Ext. Price
1+ $244.9640 $244.9640
2+ $219.6233 $439.2466
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Availability: 900 pieces
Order Increment : 1 pcs
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