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XC3S200A-4FGG320C

Part No XC3S200A-4FGG320C
Manufacturer Xilinx Inc.
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 248 I/O 320FBGA
Datasheet
Sample
Rohs State rohs
ECAD Module
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Categories Integrated Circuits
Manufacturer Xilinx Inc.
Status Active
Number of LABs/CLBs 448
Number of Logic Elements/Cells 4032
Total RAM Bits 294912
Number of I/O 248
Number of Gates 200000
Supply Voltage - Operating 1.14 V to 1.26 V
Mounting SMD (SMT)
Temperature Range - Operating 0°C to 85°C (TJ)
Case / Package 320-FBGA (19x19)
Win Source Part Number 037680-XC3S200A-4FGG320C
Is this a common-used part? Yes
Popularity High
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian XC3S200A-4FGG320C CAD Model

Description

The XC3S200A-4FGG320C is a Field-Programmable Gate Array (FPGA) from Xilinx's Spartan-3A series. As an FPGA, it offers a reprogrammable hardware solution for implementing custom digital logic. This particular part is designed for applications needing a balance between logic density, performance, and power consumption.

Applications:

  • Embedded Systems: Used for control and processing tasks in embedded applications.
  • Industrial Automation: Implementing programmable logic controllers (PLCs) and motor control systems.
  • Image Processing: Accelerating image filtering, enhancement, and analysis algorithms.
  • Communication Systems: Signal processing, data encoding/decoding, and interface control.
  • Medical Instrumentation: For implementing custom logic in medical devices and imaging systems.

Features:

  • Logic Cells: Offers approximately 4,320 logic cells, providing resources for complex digital designs.
  • Block RAM: Includes block RAM for implementing on-chip memory.
  • Distributed RAM: Features distributed RAM for smaller memory storage needs.
  • Digital Clock Managers (DCMs): Integrated DCMs for clock frequency synthesis and management.
  • I/O Pins: Provides a number of I/O pins (320-pin FGG package) for interfacing with external components.
  • Operating Voltage: Operates at a defined core voltage for compatibility with digital logic standards.
  • Temperature Grade: Comes in different temperature grades to accommodate various operating environments.
  • Configuration Options: Supports multiple configuration methods, including JTAG and SPI.

Benefits:

  • Flexibility: Enables hardware customization and reconfiguration without requiring new hardware.
  • Fast Prototyping: Accelerates product development through rapid design iteration and validation.
  • Cost-Effective: Offers a cost-efficient alternative to ASICs for low to medium volume production.
  • Performance: Delivers high performance for demanding digital logic and signal processing tasks.
  • Integration: Integrates memory, clock management, and I/O interfaces on a single chip.

Technical Specifications: The XC3S200A-4FGG320C features a core voltage around 1.2V. It comes in a 320-pin FGG package. It uses block RAM, distributed RAM, and digital clock managers. The 'C' at the end of the part number indicates commercial temperature grade, and '-4' is a speed grade.

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Pricing & Ordering

Quantity Unit Price Ext. Price
1+ $79.3649 $79.3649
2+ $76.8847 $153.7694
3+ $74.4046 $223.2138
4+ $71.9244 $287.6976
5+ $64.4840 $322.4200
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
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Availability: 4,200 pieces
Order Increment : 1 pcs
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