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XC7Z0352FFG900C

Part No XC7Z0352FFG900C
Manufacturer Xilinx Inc.
Catalog Custom Parts (U - Z)
Sample
Rohs State Need to verify
ECAD Module
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Win Source Part Number 1157228-XC7Z0352FFG900C
Categories Custom Parts
Manufacturer Xilinx Inc.
Popularity Medium
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian XC7Z0352FFG900C CAD Model

Description

The XC7Z035-2FFG900C is a System-on-Chip (SoC) device from the Zynq-7000 family manufactured by Xilinx. This SoC integrates a dual-core ARM Cortex-A9 processor with 28nm Xilinx programmable logic. This combination provides a powerful and flexible platform suitable for a wide range of embedded applications requiring both high-performance processing and adaptable hardware acceleration.

Applications

  • Industrial Automation: Used in programmable logic controllers (PLCs), motor control systems, and industrial networking for real-time control and data processing.
  • Aerospace and Defense: Deployed in radar systems, signal processing, and embedded computing platforms where high performance and reliability are critical.
  • Medical Imaging: Utilized in ultrasound, MRI, and other medical imaging devices for image processing and data acquisition.
  • Automotive: Implemented in advanced driver-assistance systems (ADAS), infotainment systems, and vehicle control units.
  • Video and Image Processing: Suitable for high-definition video encoding/decoding, image recognition, and surveillance systems.

Features

  • Dual-Core ARM Cortex-A9 Processor: Provides high-performance processing capabilities for running operating systems and applications.
  • Xilinx 7 Series Programmable Logic: Offers customizable hardware acceleration for tasks such as digital signal processing (DSP), image processing, and custom peripheral interfaces.
  • Integrated Peripherals: Includes Gigabit Ethernet, USB, CAN, UART, SPI, and I2C interfaces for connectivity and communication.
  • High-Speed Memory Interfaces: Supports DDR3, DDR2, and QSPI flash memory for efficient data storage and retrieval.
  • 900-Pin Fine-Pitch Ball Grid Array (FBGA) Package: Provides a high density of I/O pins for versatile connectivity.

Benefits

  • High Performance: Combines the processing power of ARM cores with the hardware acceleration capabilities of programmable logic.
  • Flexibility: Allows for customization and adaptation to specific application requirements through programmable logic.
  • Integration: Reduces system complexity and cost by integrating processing, programmable logic, and peripherals on a single chip.
  • Scalability: Enables the development of scalable solutions that can be easily adapted to changing requirements.
  • Time-to-Market: Shortens development cycles by providing a pre-verified hardware and software platform.

Additional Details

The XC7Z035-2FFG900C operates at a speed grade of -2. The 900-pin FFG package allows for a large number of I/O connections. The Zynq-7000 family supports a wide range of operating systems, including Linux, and real-time operating systems (RTOS). Xilinx provides comprehensive development tools, including the Vivado Design Suite, for designing and implementing custom hardware and software on the Zynq-7000 platform. The device's programmable logic includes configurable logic blocks (CLBs), block RAM, and DSP slices, allowing for the implementation of complex digital circuits. Power consumption varies depending on the application but the architecture is designed for power efficiency.

The XC7Z035-2FFG900C is a versatile SoC that offers a powerful combination of processing and programmable logic, making it well-suited for a wide range of embedded applications.

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