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224-1275-00-0602J

Part No 224-1275-00-0602J
Manufacturer 3M
Catalog Sockets for ICs, Transistors
Description CONN IC DIP SOCKET ZIF 24POS GLD / 24 (2 x 12) Pos DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Socket Gold Connector
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Connectors, Interconnects - Sockets for ICs, Transistors - IC Sockets
Mfr 3M
Series Textool™
Package Tube
Type DIP, ZIF (ZIP) , 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) 24 (2 x 12)
Pitch - Mating 0.100" (2.54mm)
Contact Finish - Mating Gold
Contact Finish Thickness - Mating 30.0µin (0.76µm)
Contact Material - Mating Beryllium Copper
Mounting Type Connector
Features Closed Frame
Termination Press-Fit
Pitch - Post 0.100" (2.54mm)
Contact Finish - Post Gold
Contact Finish Thickness - Post 30.0µin (0.76µm)
Contact Material - Post Beryllium Copper
Housing Material Polysulfone (PSU) , Glass Filled
Temperature Range - Operating -55°C ~ 125°C
Termination Post Length 0.110" (2.78mm)
Material Flammability Rating UL94 V-0
Current Rating (Amps) 1 A
Base Product Number 224
Standard Package 10
MSL Level 1 (Unlimited)
ECCN EAR99
HTSUS 8536.69.4040
Win Source Part Number 1338411-224-1275-00-0602J
Ultra Librarian 3D Model Ultra Librarian 224-1275-00-0602J CAD Model

Description

The 3M Textool™ Series is a DIP, ZIF (ZIP) type IC socket connector with 24 positions and 2 rows.

  • Positions: 24
  • Rows: 2
  • Type: DIP, ZIF (ZIP)
  • Frame: Closed
  • Termination: Press-Fit
  • Package: Tube
  • Pitch: 0.100 inches (2.54mm)
  • Contact Finish (Mating and Post): Gold, 30.0µin (0.76µm)
  • Contact Material (Mating and Post): Beryllium Copper
  • Housing Material: Polysulfone (PSU) with Glass Filled
  • Temperature Range: -55°C to 125°C
  • Current Rating: 1A
  • Application: IC and Transistor Sockets

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