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232-1270-02-0602

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Part No	232-1270-02-0602
Manufacturer	3M
Catalog	Sockets for ICs, Transistors
Description	CONN SOCKET PGA ZIF 32POS GOLD / 32 (2 x 16) Pos PGA, ZIF (ZIP) Socket Gold Through Hole
Sample
Rohs State
ECAD Module
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Products specifications Report Issue?

Category	Connectors, Interconnects - Sockets for ICs, Transistors - IC Sockets
Mfr	3M
Series	Textool™
Package	Bulk
Type	PGA, ZIF (ZIP)
Number of Positions or Pins (Grid)	32 (2 x 16)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	30.0µin (0.76µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Closed Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	30.0µin (0.76µm)
Contact Material - Post	Beryllium Copper
Housing Material	Polysulfone (PSU) , Glass Filled
Temperature Range - Operating	-55°C ~ 125°C
Termination Post Length	0.154" (3.90mm)
Material Flammability Rating	UL94 V-0
Current Rating (Amps)	1 A
Contact Resistance	25mOhm
Base Product Number	232
Standard Package	10
MSL Level	1 (Unlimited)
ECCN	EAR99
HTSUS	8536.69.4040
Win Source Part Number	1349344-232-1270-02-0602
Ultra Librarian 3D Model	Ultra Librarian 232-1270-02-0602 CAD Model

Alternative Products

Description

The 3M Textool™ PGA, ZIF (ZIP) series IC socket is designed for use in sockets for ICs, transistors, and IC sockets.

Number of Positions: 32
Frame Type: Closed
Termination: Solder
Package: Bulk
Housing Material: Polysulfone (PSU), Glass-Filled
Material Flammability Rating: UL94 V-0
Pitch: 0.100" (2.54mm)
Contact Finish: Gold
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Post Pitch: 0.100" (2.54mm)
Post Contact Finish: Gold
Post Contact Finish Thickness: 30.0µin (0.76µm)
Post Contact Material: Beryllium Copper
Operating Temperature: -55°C to 125°C

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