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XCVU13P-L2FHGA2104E

Part No XCVU13P-L2FHGA2104E
Manufacturer Amd
Catalog OEM Souring
Description FPGA Virtex UltraScale Family 3780000 Cells 20nm Technology 0.95V 2104-Pin FC-FBGA
Sample
Rohs State rohs
ECAD Module
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Category OEM Souring
Win Source Part Number 1463403-XCVU13P-L2FHGA2104E
Manufacturer Amd
Package Tray
Product Status Active
Number of LABs/CLBs 216000
Number of Logic Elements/Cells 3780000
Total RAM Bits 514867200
Number of I/O 832
Voltage - Supply 0.698V ~ 0.876V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 110°C (TJ)
Grade -
Package / Case 2104-BBGA, FCBGA
Supplier Device Package 2104-FCBGA (52.5x52.5)
Ultra Librarian 3D Model Ultra Librarian XCVU13P-L2FHGA2104E CAD Model

Description

The XCVU13P-L2FHGA2104E is part of AMD/Xilinx's highly acclaimed Virtex UltraScale family, recognized for its groundbreaking capabilities in handling complex and demanding digital signal processing applications. Built with cutting-edge 20nm technology, this FPGA (Field Programmable Gate Array) is engineered to deliver unparalleled performance efficiencies, making it an ideal choice for high-performance computing, data center, and network infrastructure. Boasting an impressive array of 3,780,000 logic cells, it provides designers with an expansive canvas to implement sophisticated algorithms that require high levels of parallel processing. The device comes in a 2104-pin FC-FBGA (Flip Chip-Fine Pitch Ball Grid Array) package, ensuring robust connectivity and heat dissipation characteristics suitable for dense electronic environments. Operating at a core voltage of 0.95V, it strikes an excellent balance between performance and power efficiency, making it a sustainable choice for eco-conscious deployments without compromising on computation power.

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