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Same model may have multiple batches, images only for reference.
XCZU1CG-1SFVA625I Real Image
Same model may have multiple batches, images only for reference.

XCZU1CG-1SFVA625I

Part No XCZU1CG-1SFVA625I
Manufacturer Amd
Catalog Embedded - System On Chip (SoC)
Description IC ZUP MPSOC CG A53 FPGA 635BGA / Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG 500MHz, 1.2GHz 625-FCBGA (21x21)
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Mfr AMD
Series Zynq® UltraScale+™ MPSoC CG
Package Tray
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
RAM Size 256KB
Peripherals DMA, WDT
Speed 500MHz, 1.2GHz
Temperature Range - Operating -40°C ~ 100°C (TJ)
Package / Case 625-BFBGA, FCBGA
Supplier Device Package 625-FCBGA (21x21)
Standard Package 1
MSL Level 4 (72 Hours)
Win Source Part Number 1337532-XCZU1CG-1SFVA625I
Ultra Librarian 3D Model Ultra Librarian XCZU1CG-1SFVA625I CAD Model

Description

The XCZU1CG-1SFVA625I is an integrated circuit (IC) from the Zynq® UltraScale+™ MPSoC CG series.

  • Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™ and Dual ARM® Cortex™-R5 with CoreSight™
  • Processor Speed: 500MHz and 1.2GHz
  • Peripherals: DMA and WDT
  • Number of I/Os: No specific number
  • RAM Size: 256KB
  • Architecture: MPU, FPGA
  • Package/Case: 625-BFBGA, FCBGA
  • Supplier Device Package: 625-FCBGA (21x21)

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