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HMC747LC3C

Part No HMC747LC3C
Manufacturer Analog Devices Inc.
Catalog RF Misc ICs and Modules
Description IC FLIP-FLOP D-TYPE 13GBPS 16SMD
Datasheet
Sample
Rohs State rohs
ECAD Module
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Category RF and Wireless - RF Misc ICs and Modules
Mfr Analog Devices Inc.
Package Strip
Product Status Active
Function Flip-Flop
Frequency 0Hz ~ 14GHz
RF Type General Purpose
Mounting Type Surface Mount
Package / Case 16-LFCQFN Exposed Pad
Supplier Device Package 16-CSMT (3x3)
Base Product Number HMC747
Standard Package 1 pcs
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001
Win Source Part Number 598793-HMC747LC3C
Ultra Librarian 3D Model Ultra Librarian HMC747LC3C CAD Model

Description

Manufactured by Analog Devices Inc., the HMC747LC3C is a high-performance, flip-chip, Silicon-Germanium (SiGe) Monolithic Microwave Integrated Circuit (MMIC) designed to meet the demanding requirements of modern digital and mixed-signal applications. This versatile component is well-suited for a wide range of applications, including but not limited to, point-to-point radios, military and space, fiber optics, and broadband test and measurement equipment.

Key Features

  • Frequency Range: The HMC747LC3C operates over a broad frequency range, making it an ideal choice for various high-frequency applications.
  • High Gain: It provides a high gain which is essential for signal amplification in communication systems.
  • Low Noise Figure: The low noise figure of the HMC747LC3C ensures excellent signal integrity, which is critical for high-performance systems.
  • Output Power: The device delivers sufficient output power, contributing to robust signal transmission over long distances.
  • Package: The flip-chip packaging allows for a compact design and efficient heat dissipation, which is vital for maintaining performance and reliability.

Applications

The HMC747LC3C is designed for high-frequency applications where performance and reliability are paramount. Its versatility makes it suitable for a variety of markets and applications, including:

  • Point-to-Point and Point-to-Multipoint Radios
  • Military Radar and Communication Systems
  • Space-bound Communication Equipment
  • Fiber Optic and Broadband Infrastructure
  • Test and Measurement Instruments

Technical Specifications

Parameter Specification Frequency Range Specified range in GHz Gain Specified gain in dB Noise Figure Specified noise figure in dB Output Power Specified output power in dBm Package Flip-chip, LC3C

For precise specifications and performance data, it is recommended to consult the detailed datasheet provided by Analog Devices Inc. This will ensure that the HMC747LC3C can be integrated effectively into your system design to meet your specific requirements.

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Pricing & Ordering

Quantity Unit Price Ext. Price
1+ $430.0752 $430.0752
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Availability: 75 pieces
Order Increment : 1 pcs
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