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MC145488FNR2

Part No MC145488FNR2
Manufacturer Freescale Semiconductor - NXP
Catalog OEM Parts (M - N)
Description Motorol PLCC68
Sample
Rohs State Need to verify
ECAD Module
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RoHS Non-Compliant
Win Source Part Number 1076968-MC145488FNR2
Categories OEM Parts(M-N)
Manufacturer Freescale Semiconductor - NXP
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian MC145488FNR2 CAD Model

Description

The MC145488FNR2 is a Subscriber Line Interface Circuit (SLIC) designed to interface a voice codec to a telephone line. This component provides the necessary functions to power, control, and protect the telephone line interface in various telecommunication systems.

Applications:

  • Analog Line Cards in Central Office (CO) switches
  • Private Branch Exchange (PBX) systems
  • Voice over Internet Protocol (VoIP) gateways
  • Customer Premises Equipment (CPE) such as modems and routers
  • Wireless Local Loop (WLL) applications

Features:

  • Integrated DC battery feed and AC ringing generation
  • Short circuit protection and overvoltage protection for robust line interface
  • Loop current regulation to maintain stable voice transmission
  • Provides BORSCHT functions (Battery feed, Overvoltage protection, Ringing, Supervision, Codec interface, Hybrid, and Testing)
  • Low power consumption for energy-efficient designs
  • Programmable parameters for flexible adaptation to different line conditions
  • Supports various signaling protocols

Benefits:

  • Simplified telephone line interface design
  • Reduced component count and board space
  • Improved system reliability due to integrated protection features
  • Enhanced voice quality through loop current regulation
  • Cost-effective solution for telecommunication applications
  • Enables compliance with international telecommunication standards

Additional Details:

The MC145488FNR2 operates over a wide voltage range and temperature range, making it suitable for diverse operating environments. The device typically includes comprehensive diagnostic capabilities to facilitate system maintenance and troubleshooting. The packaging is designed for efficient heat dissipation and easy integration into printed circuit boards. Its low power consumption contributes to energy efficiency, reducing operational costs. This SLIC component is a critical part of ensuring reliable and high-quality voice communication in a wide array of telecommunications infrastructure.

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