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GS840Z18AGT-150I

Part No GS840Z18AGT-150I
Manufacturer GSI Technology
Catalog OEM Parts (F - I)
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Address Bus Width 18 b
Mounting SMD (SMT)
Case / Package TQFP
Density 4.5 Mb
Maximum Operating Temperature 85 °C
Min Operating Temperature -40 °C
Number of Ports 2
Operating Supply Voltage 3.3 V
Radiation Hardening No
RoHS Compliant
Win Source Part Number 996523-GS840Z18AGT-150I
Categories OEM Parts(F-I)
Manufacturer GSI Technology
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian GS840Z18AGT-150I CAD Model

Description

The GS840Z18AGT-150I is a high-performance synchronous static random-access memory (SRAM) device manufactured by GSI Technology. It is designed for applications requiring high bandwidth and fast access times, typically found in networking, telecommunications, and high-performance computing systems. The '150I' likely refers to the speed grade (150 MHz) and temperature range (Industrial).

Applications

  • Networking Equipment
  • Telecommunications Systems
  • High-Performance Computing
  • Data Acquisition Systems
  • Image Processing

Features

  • High-Speed Operation (150 MHz)
  • 72 Megabit Density (4M x 18)
  • 2.5V Power Supply
  • QDRII+ or DDRII+ Architecture (consult datasheet for exact type)
  • Burst Mode Operation
  • TTL-Compatible Inputs and Outputs
  • Available in BGA Package
  • Industrial Temperature Range

Benefits

  • Improved system performance due to fast data access times and high bandwidth.
  • Increased data throughput in demanding applications.
  • Reduced latency and improved responsiveness.
  • Simplified system integration with TTL-compatible I/O.
  • Compact design due to the BGA package.
  • Suitable for harsh environments due to the industrial temperature range.

Additional Details

The GS840Z18AGT-150I operates on a 2.5V power supply and features high-speed operation at 150 MHz. It has a 72 Megabit memory density. The device utilizes either a QDRII+ or DDRII+ architecture (refer to the datasheet for the specific type), enabling high-bandwidth data transfers. It supports burst mode operation, which further enhances data throughput. TTL-compatible inputs and outputs simplify interfacing with other digital components. Available in a BGA (Ball Grid Array) package. The industrial temperature range makes it suitable for operation in harsh environments. It is commonly used in networking equipment, telecommunications systems, and high-performance computing systems requiring high speed and reliability.

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