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HYB25L512160AC-7.5

Part No HYB25L512160AC-7.5
Manufacturer Infineon Technologies
Catalog Memory
Description IC DRAM 512MBIT PARALLEL 54FBGA
Sample
Rohs State Need to verify
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs) - Memory - Memory
Mfr Infineon Technologies
Package Bulk
Product Status Active
Programmable Not Verified
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - Mobile LPDDR
Memory Size 512Mbit
Memory Organization 32M x 16
Memory Interface Parallel
Clock Frequency 133 MHz
Write Cycle Time - Word, Page 14ns
Access Time 6 ns
Voltage - Supply 2.3V ~ 3.6V
Temperature Range - Operating 0°C ~ 70°C (TC)
Mounting Type Surface Mount
Package / Case 54-LFBGA
Supplier Device Package 54-FBGA (8x12)
Standard Package 1 pcs
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.32.0028
Win Source Part Number 150544-HYB25L512160AC-7.5
Ultra Librarian 3D Model Ultra Librarian HYB25L512160AC-7.5 CAD Model

Description

The Infineon Technologies 150544-HYB25L512160AC-7.5 is a 512Mbit SDRAM memory chip. It is part of the Memory category of electronic components. This product comes in a bulk package and the standard package includes 1 piece. It is a volatile memory type and operates at a voltage range of 2.3V to 3.6V. The memory size is 512Mbit and the access time is 6ns. The clock frequency is 133MHz and the write cycle time is 14ns. This product has a parallel memory interface and is suitable for use in mobile LPDDR applications. The MSL level is 3, indicating it can withstand 168 hours of moisture sensitivity. The REACH status is unaffected and the HTSUS code is 8542.32.0028. Infineon Technologies is the manufacturer of this product.

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Pricing & Ordering

Quantity Unit Price Ext. Price
17+ $3.5239 $59.9063
40+ $2.8910 $115.6400
62+ $2.8009 $173.6558
86+ $2.7108 $233.1288
111+ $2.6207 $290.8977
148+ $2.3493 $347.6964
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Availability: 42,300 pieces
MOQ: 17 pcs
Order Increment : 1 pcs
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