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EP4SGX360FF35I4N

Part No EP4SGX360FF35I4N
Manufacturer Intel
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 564 I/O 1152FBGA  /  series Field Programmable Gate Array (FPGA) IC 564 23105536 353600 1152-BBGA, FCBGA
Datasheet
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs)>Embedded - FPGAs (Field Programmable Gate Array)
Mfr Intel
Series Stratix® IV GX
Package Tray
Product Status Obsolete
Number of LABs/CLBs 14144
Number of Logic Elements/Cells 353600
Total RAM Bits 23105536
Number of I/O 564
Voltage - Supply 0.87V ~ 0.93V
Mounting SMD (SMT)
Temperature Range - Operating -40°C ~ 100°C (TJ)
Package / Case 1152-BBGA, FCBGA
Supplier Device Package 1152-FBGA (35x35)
Base Product Number EP4SGX360
MSL Level 3 (168 Hours)
ECCN 3A001A7A
HTSUS 8542.39.0001
Other Names 974490
Standard Package 24
Win Source Part Number 1018788-EP4SGX360FF35I4N
Ultra Librarian 3D Model Ultra Librarian EP4SGX360FF35I4N CAD Model

Description

The Intel EP4SGX360FF35I4N is a high-performance, Stratix IV GX FPGA designed for demanding applications requiring significant logic density, memory, and high-speed transceivers. It offers a balance of performance and power efficiency, making it suitable for a wide range of applications.

Applications

  • High-Speed Networking: Used in routers, switches, and other networking equipment for packet processing and data forwarding.
  • Data Center Acceleration: Employed in servers and storage systems to accelerate computationally intensive tasks such as encryption, compression, and data analytics.
  • Wireless Communication: Utilized in base stations and other wireless infrastructure equipment for signal processing and protocol implementation.
  • Broadcast Video: Used in video processing equipment for encoding, decoding, and transcoding video streams.
  • Military and Aerospace: Employed in radar systems, electronic warfare systems, and other defense applications.

Features

  • Logic Elements: Features 360,400 logic elements (LEs) providing a high degree of flexibility for complex designs.
  • Memory: Includes 17,784 Kbits of embedded memory for storing large amounts of data on-chip.
  • Multipliers: Equipped with 1,288 embedded 18 x 18 multipliers, enabling high-performance digital signal processing (DSP) capabilities.
  • I/O Pins: Offers 1,120 user I/O pins for extensive connectivity with external devices.
  • Transceivers: Supports 48 high-speed transceivers with data rates up to 11.3 Gbps for high-bandwidth serial communication.
  • Package: Available in a 1152-pin FineLine BGA (FBGA) package.
  • Clock Management: Incorporates advanced clock management circuitry, including multiple phase-locked loops (PLLs), for precise clock generation and distribution.

Benefits

  • High Performance: Delivers exceptional processing power and throughput for demanding applications.
  • High Bandwidth: Supports high-speed serial communication with integrated transceivers.
  • Flexibility: Offers a highly configurable architecture that can be adapted to meet specific application needs.
  • Scalability: Provides a scalable solution for growing system requirements.
  • Advanced Features: Incorporates advanced features such as power optimization techniques and error correction coding.

Additional Details

The EP4SGX360FF35I4N operates over an industrial temperature range. It is designed to be compatible with industry-standard development tools, including Intel's Quartus II software. This device supports various configuration options, including JTAG, Active Serial (AS), and Passive Serial (PS) modes. The internal memory can be used for storing program code, data buffers, or look-up tables. The device supports various I/O standards, including LVTTL, LVCMOS, and SSTL.

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1+ $979.2402 $979.2402
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