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BGA2717

Part No BGA2717
Manufacturer NXP / Nexperia
Catalog RF Amplifiers
Description MMIC wideband amplifier
Sample
Rohs State Need to verify
ECAD Module
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Products specifications Report Issue?

RoHS State Request Verification
Manufacturer NXP
Win Source Part Number 1153393-BGA2717
Manufacturer Homepage www.nxp.com
Popularity Medium
Supply and Demand Status Balance
Ultra Librarian 3D Model Ultra Librarian BGA2717 CAD Model

Description

    

Introducing the BGA2717 MMIC Amplifier by NXP

    

The BGA2717 is a silicon monolithic microwave integrated circuit (MMIC) amplifier designed by NXP Semiconductors, a leader in the industry. This versatile amplifier is built using a 6 GHz fT silicon process, ensuring it provides a high level of performance for a wide range of applications.

    

Key Features

    
            
  • Frequency Range: The BGA2717 operates in a broad frequency range from 400 MHz to 2.5 GHz, making it suitable for various applications including but not limited to LNA and PA driver amplifiers in GSM, PCS, DCS, UMTS, and LTE systems.
  •         
  • Gain: This amplifier provides a high gain of 20 dB with a 5 V supply voltage, which is crucial for signal amplification in communication systems.
  •         
  • Output Power: It delivers a strong output power (P1dB) of 22 dBm, ensuring robust signal amplification even in demanding environments.
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  • Low Noise Figure: With a low noise figure of 1.3 dB, the BGA2717 maintains signal integrity by minimizing the addition of noise during amplification.
  •         
  • Supply Voltage: The device operates on a supply voltage range of 2.7 to 5.5 V, offering flexibility in various power supply scenarios.
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Applications

    

The BGA2717 is an excellent choice for a broad spectrum of RF applications. It is particularly well-suited for use as a Low Noise Amplifier (LNA) or as a driver amplifier in mobile communication systems due to its high linearity and low noise performance. It can also be utilized in cable TV systems, GPS devices, wireless communication infrastructure, and any other RF system requiring a high-performance amplifier.

    

Package and Integration

    

The amplifier is housed in a 6-pin SOT363 (SC-88) plastic package, which is not only compact but also allows for easy integration into existing and new designs. The BGA2717 is also characterized by its excellent thermal and electrical stability, making it a reliable component for continuous operation in various conditions.

    

With its impressive features and performance, the BGA2717 from NXP stands out as a top-tier solution for RF amplification needs in a multitude of high-frequency applications.

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