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BYG80G

Part No BYG80G
Manufacturer NXP / Nexperia
Catalog Diodes, Rectifiers - Single
Description Ultra fast low-loss controlled avalanche rectifiers / Diode Switching 400V 2.3A 2-Pin SMA
Sample
Rohs State rohs
ECAD Module
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Category Discrete Semiconductor Products
Family Diodes,Rectifiers - Single
Manufacturer NXP
Win Source Part Number 238406-BYG80G
Popularity Medium
Supply and Demand Status Balance
Family Name BYG80G
Introduction Date May 24, 1996
Estimated EOL Date Obsolete / End of life
Ultra Librarian 3D Model Ultra Librarian BYG80G CAD Model

Description

The NXP BYG80G is a state-of-the-art ultra-fast rectifier diode designed to meet the demanding requirements of modern electronic circuits. With its exceptional performance and reliability, this component is ideally suited for high-frequency rectification and switching applications in power supplies, converters, and other electronic devices.

Key Features

  • Reverse Voltage: The BYG80G offers a maximum repetitive reverse voltage of 600V, making it an excellent choice for systems that require a high breakdown voltage.
  • Forward Current: It has a high average forward current of 1.5A, which ensures that the diode can handle significant levels of current without overheating or failing.
  • Ultra-Fast Recovery Time: The device boasts an ultra-fast recovery time, typically less than 75ns, which minimizes power loss and improves the efficiency of the overall circuit.
  • Low Forward Voltage Drop: With a low forward voltage drop, the BYG80G ensures lower power dissipation, contributing to the energy efficiency of the application it is used in.
  • High Surge Current Capability: Its ability to withstand high surge currents makes it robust and reliable under stressful conditions.

Applications

The BYG80G is versatile and can be used in a variety of applications, including:

  • Switching power supplies
  • Converters
  • Free-wheeling diodes in inverters
  • Power management devices
  • High-frequency rectifiers

Quality and Reliability

NXP is known for its commitment to quality, and the BYG80G is no exception. It is manufactured using a glass passivated chip, which provides enhanced reliability and a long operational life. The component is also compliant with the RoHS directive, making it an environmentally friendly choice for manufacturers who are conscious about reducing hazardous substances in their products.

Package and Installation

The BYG80G comes in a compact SOD-57 package, which is suitable for through-hole mounting. This packaging allows for easy integration into a wide range of electronic circuits while ensuring good thermal performance and mechanical robustness.

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