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SPC5775BDK3MME2

Part No SPC5775BDK3MME2
Manufacturer NXP / Nexperia
Catalog Embedded - Microcontrollers
Description IC MCU 32BIT 4MB FLASH 416MAPBGA  /  e200z7 series Microcontroller IC 32-Bit Dual-Core 220MHz 4MB (4M x 8) FLASH 416-MAPBGA (27x27)
Sample
Rohs State rohs
ECAD Module
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Category Integrated Circuits (ICs)>Embedded - Microcontrollers
Mfr NXP USA Inc.
Series MPC57xx
Package Tray
Core Processor e200z7
Core Size 32-Bit Dual-Core
Speed 220MHz
Connectivity CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals DMA, LVD, POR, Zipwire
Number of I/O 293
Program Memory Size 4MB (4M x 8)
Program Memory Type FLASH
RAM Size 512K x 8
Supply Voltage - Operating 3V ~ 5.5V
Data Converters A/D 40x12b eQADCx2
Oscillator Type External
Temperature Range - Operating -40°C ~ 125°C (TA)
Mounting SMD (SMT)
Package / Case 416-BGA
Supplier Device Package 416-MAPBGA (27x27)
Base Product Number SPC5775
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A992C
HTSUS 8542.31.0001
Other Names 935371593557,568-14628
Standard Package 200
Win Source Part Number 1019198-SPC5775BDK3MME2
Ultra Librarian 3D Model Ultra Librarian SPC5775BDK3MME2 CAD Model

Description

Product Overview: NXP SPC5775BDK3MME2

The NXP SPC5775BDK3MME2 is a state-of-the-art microcontroller designed to cater to the rigorous demands of automotive and industrial applications. As part of the Power Architecture family, it is built for performance, reliability, and versatility, making it an ideal choice for a wide range of high-end applications.

Key Features:

  • Advanced Core: The SPC5775BDK3MME2 is equipped with a dual-core Power Architecture e200z7, running at speeds up to 264 MHz, providing robust computational power for complex tasks.
  • Memory: It comes with an integrated 4 MB Flash memory and 592 KB of RAM, ensuring smooth operation and sufficient space for sophisticated applications.
  • Enhanced Safety: Safety features compliant with the ISO 26262 standard make this microcontroller suitable for safety-critical applications, with fault detection mechanisms to ensure reliable operation.
  • Connectivity: Multiple communication interfaces including Ethernet, FlexRay, LIN, and CAN modules provide versatile connectivity options for various automotive networks.
  • Timers and ADCs: The inclusion of advanced timers, multiple Analog-to-Digital Converters (ADCs), and Digital-to-Analog Converters (DACs) support precise control and sensor interfacing.

Applications:

The SPC5775BDK3MME2 is engineered for high-performance applications within the automotive sector, such as engine management systems, transmission control units, and advanced driver-assistance systems (ADAS). Its robust design also makes it suitable for industrial automation and control systems where precision and reliability are paramount.

Development Support:

Developers can take advantage of NXP's comprehensive suite of development tools for the SPC5775BDK3MME2, including software drivers, operating systems, and integrated development environments (IDEs). This support accelerates the development process and helps bring products to market faster.

In summary, the NXP SPC5775BDK3MME2 microcontroller offers a powerful combination of processing capability, memory capacity, safety features, and connectivity options, making it an exceptional choice for designers and engineers looking for a high-performance solution in automotive and industrial applications.

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Pricing & Ordering

Quantity Unit Price Ext. Price
1+ $58.1321 $58.1321
3+ $47.6982 $143.0946
4+ $46.2076 $184.8304
5+ $44.7170 $223.5850
6+ $43.2265 $259.3590
8+ $38.7548 $310.0384
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Prices are subject to market and will be confirmed after the order is placed.
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
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Availability: 1,000 pieces
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