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HYB18T512400B2F-3.7

Part No HYB18T512400B2F-3.7
Manufacturer Qimonda
Catalog DDR
Description DDR2-533 128Mx4 CL4 Pb-Free FBGA
Sample
Rohs State rohs
ECAD Module
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Categories Memory
Win Source Part Number 942155-HYB18T512400B2F-3.7
Series *
Ultra Librarian 3D Model Ultra Librarian HYB18T512400B2F-3.7 CAD Model

Description

The HYB18T512400B2F-3.7 is a DDR2 SDRAM (Double Data Rate 2 Synchronous Dynamic Random-Access Memory) module produced by Qimonda. Designed for high-speed data access, it is suitable for various applications needing significant memory bandwidth, including desktop PCs, laptops, and embedded systems.

Applications

  • Desktop Computers
  • Laptop Computers
  • Embedded Systems
  • Graphics Cards
  • Networking Equipment

Features

  • Capacity: 512 Meg x 4 bits
  • Data Rate: DDR2, offering improved bandwidth compared to DDR SDRAM.
  • Clock Frequency: The -3.7 designation likely indicates the speed grade, influencing the operating frequency.
  • Voltage: Operates at 1.8V, typical for DDR2 SDRAM, ensuring power efficiency.
  • Interface: Utilizes a DDR2 interface, offering wide compatibility with DDR2-supporting systems.
  • Package: Typically available in a FBGA package for efficient mounting and thermal characteristics.

Benefits

  • Enhanced Bandwidth: DDR2 technology enables higher memory bandwidth, boosting system performance.
  • Reduced Power Consumption: Operates at a lower voltage, reducing power consumption and heat.
  • Improved System Performance: Supports faster application loading, smoother multitasking, and enhanced responsiveness.
  • Reliable Operation: Manufactured by Qimonda, a former key player in the memory industry, promising reliability.
  • Wide Compatibility: Designed to be compatible with systems supporting DDR2 memory.

Additional Details

The HYB18T512400B2F-3.7 is compliant with JEDEC standards for DDR2 SDRAM, ensuring interoperability and adherence to industry specifications. Features include on-chip DLL (Delay-Locked Loop) for clock alignment and data synchronization. Power-saving modes are integrated to reduce power consumption during idle states. The '-3.7' suffix denotes the speed grade, crucial for determining the memory's maximum clock frequency and access time. Ensure memory speed matches system requirements for optimal performance. The FBGA package facilitates heat dissipation and high-density board layouts. Since Qimonda is no longer operating, sourcing this component may require searching for remaining stock or compatible alternatives.

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