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FTSH-112-02-L-DH-A-C-TR-.MUL

Part No FTSH-112-02-L-DH-A-C-TR-.MUL
Manufacturer Samtec Inc.
Catalog Custom Parts (E - I)
Description .050" Micro Terminal Strip
Sample
Rohs State Need to verify
ECAD Module
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Win Source Part Number 1211101-FTSH-112-02-L-DH-A-C-TR-.MUL
Categories Custom Parts
Manufacturer Samtec Inc.
Popularity Medium
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian FTSH-112-02-L-DH-A-C-TR-.MUL CAD Model

Description

The FTSH-112-02-L-DH-A-C-TR-.MUL is a micro header strip manufactured by Samtec Inc. It is part of the FTSH series, known for its fine-pitch design and suitability for high-density applications. These header strips provide a reliable and compact solution for board-to-board connections in a variety of electronic devices.

Applications

  • Board-to-board connections in compact electronic devices
  • Signal and data transmission
  • Medical devices
  • Industrial control systems
  • Consumer electronics

Features

  • Fine-pitch design for high-density applications
  • Surface mount technology (SMT)
  • Dual-row configuration
  • Low profile
  • Automatic Pick & Place Compatibility

Benefits

  • Efficient use of board space
  • Reliable signal transmission
  • Easy integration into automated assembly processes
  • Compact design for smaller devices
  • Increased design flexibility

Additional Details

The FTSH-112-02-L-DH-A-C-TR-.MUL header has specific details regarding the number of pins, pitch (fine pitch, typically 1.27mm or 0.050 inch), row spacing, and plating options. The datasheet from Samtec Inc. provides complete information on these specifications. The part number also reveals details such as the number of positions (12 per row, hence 24 total for dual-row), the insulator material, and the packaging type (Tape and Reel -TR). The -A denotes alignment pin, -C denotes a capacitor and .MUL likely designates it as a specific ordering code. This header is commonly used in applications where space is limited and a reliable connection is crucial. The fine-pitch design enables high-density mounting, making it ideal for modern electronic devices. It's optimized for automated assembly, reducing manufacturing costs and increasing production efficiency.

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