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SKY77468-17

Part No SKY77468-17
Manufacturer Skyworks Solutions Inc.
Catalog OEM Parts ( S )
Sample
Rohs State Need to verify
ECAD Module
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Products specifications Report Issue?

RoHS Non-Compliant
Win Source Part Number 1093405-SKY77468-17
Categories OEM Parts( S )
Manufacturer Skyworks Solutions Inc.
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian SKY77468-17 CAD Model

Description

The SKY77468-17 is a multimode multiband (MMMB) Power Amplifier Module (PAM) from Skyworks Solutions Inc. designed for high-performance 2.5G and 3G mobile communication devices. This PAM supports multiple frequency bands and modulation schemes, making it a versatile solution for global cellular connectivity.

Applications

  • 2.5G and 3G mobile handsets
  • Smartphones
  • Data cards
  • Wireless modules

Features

  • GSM850/900/1800/1900 and UMTS Bands I/II/IV/V/VIII support
  • High Power Efficiency
  • Low transmit current consumption
  • Integrated transmit filter
  • Small and compact size
  • Meets or exceeds 3GPP standards

Benefits

  • Extended battery life for mobile devices due to high efficiency.
  • Reduced PCB area due to the compact design and integrated components.
  • Improved system performance with integrated filtering and matching networks.
  • Global compatibility with support for multiple frequency bands.
  • Simplified manufacturing process with a highly integrated module.

Additional Details

The SKY77468-17 PAM integrates multiple power amplifiers, transmit filters, impedance matching networks, and control circuitry into a single module. This integration simplifies the design process and reduces the number of external components required. It's designed to operate with a supply voltage typically in the range of 3.2 to 4.8V. The module's power control is handled through dedicated control pins, enabling precise power management and optimization for different operating modes. It also features excellent harmonic performance, ensuring compliance with regulatory requirements. The compact size makes it suitable for integration in space-constrained mobile devices. It is typically mounted using surface mount technology (SMT).

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