The S29GL128P90TFIR23A is a 128 Mbit (16 M x 8 or 8 M x 16) parallel flash memory device manufactured by Spansion (now part of Cypress Semiconductor). It's designed for high-performance, high-density storage in embedded systems.

Applications

• Embedded Systems
• Networking Equipment
• Automotive Systems (e.g., instrument clusters, infotainment systems)
• Industrial Control Systems
• Consumer Electronics (e.g., set-top boxes, printers)

Features

• 128 Mbit (16 M x 8 or 8 M x 16) Density
• Parallel Interface
• 90 ns Read Access Time
• Sector Erase Architecture
• Page Program (256 Bytes per Page)
• Common Flash Interface (CFI)
• Write Protection Features
• Operating Voltage: 2.7 V to 3.6 V
• Operating Temperature: -40°C to +85°C

Benefits

• High Density: Offers a large storage capacity for code and data in embedded applications.
• Fast Read Performance: The 90 ns access time enables quick code execution and data retrieval.
• Flexible Sector Erase: Allows for efficient memory management by erasing only the necessary sectors.
• Fast Programming: Page program feature accelerates the programming process.
• Standard Interface: CFI provides a standard interface for easy integration with various microcontrollers and systems.
• Data Protection: Write protection features prevent accidental data corruption.
• Wide Operating Voltage Range: Provides compatibility with different power supply systems.
• Industrial Temperature Range: Suitable for use in harsh environments.

Additional Details

The S29GL128P90TFIR23A supports both byte-wide (x8) and word-wide (x16) operation, providing flexibility in system design. The sector erase architecture allows for individual sectors to be erased without affecting other parts of the memory. The page program feature allows multiple bytes to be programmed simultaneously, increasing programming speed. The CFI provides a standardized way to identify the device and its features, simplifying software development. The device also includes various protection features to prevent accidental erasure or programming. It comes in a variety of packages including TSOP and BGA. The specific package affects physical dimensions and soldering requirements.

Refer to the datasheet for detailed timing specifications, package dimensions, and other technical information.