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STM32MP157CAD3T

Part No STM32MP157CAD3T
Manufacturer STMicroelectronics
Catalog OEM Souring
Description MPU MP157 Arm Cortex-A7 650MHz, M4 TFBGA-257 -40+ 125C
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Category OEM Souring
Win Source Part Number 1462291-STM32MP157CAD3T
Manufacturer STMicroelectronics
Package Tray
Product Status Active
Core Processor ARM® Cortex®-A7
Number of Cores/Bus Width 2 Core, 32-Bit
Speed 209MHz, 650MHz
Co-Processors/DSP ARM® Cortex®-M4
RAM Controllers DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration Yes
Display & Interface Controllers HDMI-CEC, LCD
Ethernet 10/100Mbps, GbE
USB USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage - I/O 2.5V, 3.3V
Operating Temperature -40°C ~ 125°C (TA)
Grade -
Security Features ARM TZ
Mounting Type Surface Mount
Package / Case 257-TFBGA
Supplier Device Package 257-TFBGA (10x10)
Additional Interfaces CAN, Ethernet, I²C, MMC/SD/SDIO, SPDIF, SPI, UART, USB
Ultra Librarian 3D Model Ultra Librarian STM32MP157CAD3T CAD Model

Description

The STM32MP157CAD3T is a Microprocessor Unit (MPU) developed by STMicroelectronics, renowned for its high-performance silicon products. This MPU is based on the powerful dual-core MP157 chipset, featuring both an Arm Cortex-A7 processor operating up to 650MHz, and a Cortex-M4 processor designed for real-time operations. Its architecture supports a dual processing environment, where high-capacity computing and real-time processing can occur simultaneously, offering an optimal solution for complex embedded systems. It comes in a TFBGA-257 package, ensuring a compact footprint while providing extensive I/O capabilities. The STM32MP157CAD3T operates across a broad temperature range from -40 to +125°C, suitable for demanding environments. With rich multimedia support, extensive connectivity options, and flexible memory integration, it's ideal for applications in industrial automation, consumer electronics, smart home solutions, and automotive systems. By leveraging STMicroelectronics' sophisticated technology, developers can create highly integrated, efficient, and innovative designs.

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