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TLP3062(D4F2SC,F,T)

Part No TLP3062(D4F2SC,F,T)
Manufacturer Toshiba Semiconductor and Storage
Catalog Optoisolators - Triac, SCR Output
Sample
Rohs State rohs
ECAD Module
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Category Isolators
Family Optoisolators - Triac,SCR Output
Manufacturer Toshiba Semiconductor and Storage
Win Source Part Number 218191-TLP3062(D4F2SC,F,T)
Popularity Low
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian TLP3062(D4F2SC,F,T) CAD Model

Description

The TLP3062(D4F2SC,F,T) is a Phototriac Coupler manufactured by Toshiba Semiconductor and Storage. This device integrates an infrared emitting diode (IRED) and a triac driver IC within a single package to provide electrical isolation and control of AC loads.

Applications

  • Solid-State Relays (SSRs)
  • Industrial Control Systems
  • Lighting Control
  • AC Motor Control
  • Solenoid and Valve Control

Features

  • High Isolation Voltage: 5000 Vrms (minimum)
  • Off-State Voltage: 400V (minimum)
  • Trigger LED Current: 5mA (maximum)
  • On-State Current: 100mA (maximum)
  • Operating Temperature: -55°C to 100°C
  • Package: DIP-6

Benefits

  • Provides electrical isolation between low-voltage control circuits and high-voltage AC loads.
  • Enables direct control of AC loads from logic-level signals.
  • Enhances system safety by preventing ground loops and electrical hazards.
  • Offers a compact and reliable alternative to electromechanical relays.
  • Reduces electromagnetic interference (EMI) and radio frequency interference (RFI).
  • Improved lifespan over mechanical relays, reducing maintenance.

Additional Details

The TLP3062(D4F2SC,F,T) is designed to meet stringent safety standards and is commonly used in applications requiring robust isolation. It typically comes in a DIP-6 package for easy integration into circuit boards. The device’s low trigger current allows for direct interfacing with microcontrollers and other digital logic devices. Proper heat sinking might be required depending on the load current. The 'D4F2SC,F,T' suffix likely refers to specific packaging or testing variations, so referencing the datasheet is crucial for specific implementation details.

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