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PA3017L HTSSOP-20

Part No PA3017L HTSSOP-20
Manufacturer UTC
Catalog HOT - SALES and EOL Components (N - P)
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Manufacturer UTC
Win Source Part Number 267446-PA3017L HTSSOP-20
Popularity Low
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian PA3017L HTSSOP-20 CAD Model

Description

The PA3017L is a power amplifier IC manufactured by UTC (Unisonic Technologies Co., Ltd.). It's packaged in a HTSSOP-20 (thermally enhanced thin shrink small outline package) offering efficient heat dissipation. It's designed for audio amplification purposes. Specific details beyond this require further investigation of available datasheets.

Applications

  • Portable audio devices (speakers, headphones)
  • Car audio systems
  • Consumer electronics (televisions, soundbars)
  • Industrial audio applications
  • Any system requiring audio amplification with efficient thermal management

Features

  • HTSSOP-20 package for enhanced thermal performance
  • Low distortion audio amplification
  • Wide supply voltage range (specific range defined in datasheet)
  • Built-in thermal shutdown protection
  • Short circuit protection
  • Mute function
  • Standby mode for low power consumption

Benefits

  • Efficient heat dissipation allows for higher power output without overheating.
  • High-quality audio reproduction with minimal distortion ensures a clear and enjoyable listening experience.
  • Suitable for a wide range of applications due to the flexible supply voltage range.
  • Built-in protection features prevent damage to the IC and the connected speakers.
  • The mute function allows for quick and silent audio muting.
  • Standby mode minimizes power consumption when the amplifier is not in use, extending battery life in portable devices.

Technical Specifications

Detailed specifications such as output power, total harmonic distortion (THD), signal-to-noise ratio (SNR), and supply voltage range are available in the official UTC datasheet for the PA3017L. The datasheet will also provide information on the pinout, package dimensions, and recommended operating conditions. Further details may include thermal resistance specifications for calculating heat sink requirements. Detailed application notes can also be found. UTC should be contacted for precise specifications.

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