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W25Q256JVMIM

Part No W25Q256JVMIM
Manufacturer Winbond Electronics
Catalog IT infrastructure Memory
Description 256Mb Serial SpiFlash
Sample
Rohs State rohs
ECAD Module
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Category IT infrastructure Memory
Win Source Part Number 1453899-W25Q256JVMIM
Manufacturer Winbond Electronics
Package Tray
Product Status Active
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NOR
Memory Size 256Mbit
Memory Organization 32M x 8
Memory Interface SPI - Quad I/O
Clock Frequency 133MHz
Write Cycle Time - Word, Page 3ms
Access Time 6ns
Voltage - Supply 2.7V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA)
Grade -
Mounting Type Surface Mount
Package / Case 8-WLGA Exposed Pad
Supplier Device Package 8-WFLGA (6x5)
Ultra Librarian 3D Model Ultra Librarian W25Q256JVMIM CAD Model

Description

The W25Q256JVMIM is a 256Mb Serial SpiFlash memory chip designed and manufactured by Winbond, a leader in the field of memory solutions. This device is part of the W25Q family, which is known for its high performance, reliability, and efficiency. It employs the Serial Peripheral Interface (SPI) for communication, offering high-speed read and write operations and enabling fast data transfer rates that are well-suited for a variety of computing and consumer electronics applications. With its 256Mb storage capacity, it provides ample space for firmware storage, data logging, and other memory-intensive tasks. The device also features advanced security and protection mechanisms, including write protection, hardware lock functions, and a unique serial number for device identification. Its low-energy consumption and small form factor make the W25Q256JVMIM an excellent choice for portable and battery-powered applications, such as wearable devices, smart cards, and IoT devices.

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