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W25Q32JWSSIM

Part No W25Q32JWSSIM
Manufacturer Winbond Electronics
Catalog IT infrastructure Memory
Description 32Mb NOR SpiFlash
Sample
Rohs State rohs
ECAD Module
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Category IT infrastructure Memory
Win Source Part Number 1453840-W25Q32JWSSIM
Manufacturer Winbond Electronics
Package Tube
Product Status Active
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NOR
Memory Size 32Mbit
Memory Organization 4M x 8
Memory Interface SPI - Quad I/O, QPI, DTR
Clock Frequency 133MHz
Write Cycle Time - Word, Page 5ms
Access Time 6ns
Voltage - Supply 1.7V ~ 1.95V
Operating Temperature -40°C ~ 85°C (TA)
Grade -
Mounting Type Surface Mount
Package / Case 8-SOIC (0.209", 5.30mm Width)
Supplier Device Package 8-SOIC
Ultra Librarian 3D Model Ultra Librarian W25Q32JWSSIM CAD Model

Description

The W25Q32JWSSIM is a compact, high-performance 32Mb NOR SpiFlash memory chip developed by Winbond, a leader in semiconductor storage solutions. This chip is specifically designed for applications requiring high-speed data transfer, low power consumption, and compact form factor, making it ideally suited for IoT devices, wearables, and portable electronics. The NOR Flash architecture provides fast read speeds, essential for applications where quick access to data is critical. Additionally, the SpiFlash interface ensures simplified integration into various system designs, offering versatility across numerous platforms. Engineered for reliability, the W25Q32JWSSIM supports a wide range of temperature and operating conditions, making it a robust choice for applications in challenging environments. Its efficient design and capacity make it an excellent option for developers looking to balance performance with cost-effectiveness in their memory storage solution.

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