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XC2V3000-5FG676C

Part No XC2V3000-5FG676C
Manufacturer Xilinx Inc.
Catalog Embedded - FPGAs (Field Programmable Gate Array)
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Category Integrated Circuits(ICs)
Family Embedded - FPGAs(Field Programmable GateArray)
Manufacturer Xilinx Inc.
Win Source Part Number 412529-XC2V3000-5FG676C
Popularity Low
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian XC2V3000-5FG676C CAD Model

Description

The XC2V3000-5FG676C is a high-performance Virtex-II series Field-Programmable Gate Array (FPGA) from Xilinx. It's designed for complex digital circuit implementation, offering a flexible and efficient platform for a wide range of applications. This particular part comes in a Fine-Pitch Ball Grid Array (FBGA) package with 676 pins, denoted by the FG676C.

Applications:

  • Telecommunications Infrastructure: Used in network switches, routers, and base stations for signal processing, data routing, and protocol implementation.
  • Image and Video Processing: Employed in high-definition video encoding/decoding, image recognition systems, and medical imaging equipment.
  • Aerospace and Defense: Utilized in radar systems, electronic warfare applications, and guidance systems due to its high performance and reliability.
  • Industrial Automation: Found in programmable logic controllers (PLCs), motor control systems, and robotics applications.
  • Data Acquisition and Signal Processing: Integrated in high-speed data acquisition systems, spectrum analyzers, and software-defined radios.

Features:

  • System Performance: High-speed logic fabric with dedicated resources for arithmetic and signal processing.
  • On-Chip Memory: Substantial block RAM for data storage and buffering, minimizing the need for external memory.
  • Digital Clock Managers (DCMs): Provide clock frequency synthesis, clock skew management, and jitter reduction.
  • Flexible I/O: Supports a wide range of I/O standards for interfacing with various external devices.
  • Configuration Options: Supports various configuration modes, including JTAG, SPI, and parallel configuration.
  • Advanced Packaging: The FG676 package provides high pin density and excellent thermal performance.

Benefits:

  • High Performance: Enables the implementation of complex algorithms and high-speed data processing.
  • Flexibility and Reconfigurability: Allows for design changes and updates without hardware modifications.
  • Reduced Time-to-Market: Speeds up the development cycle with its programmable nature.
  • Lower System Cost: Integrates multiple functions into a single device, reducing board space and component count.
  • Enhanced Reliability: Robust design and manufacturing processes ensure high reliability in demanding environments.

Additional Details:

The XC2V3000-5FG676C operates at a -5 speed grade, indicating its performance level within the Virtex-II family. The internal architecture consists of Configurable Logic Blocks (CLBs) interconnected by a versatile routing matrix, allowing for efficient implementation of complex digital circuits. The device also includes dedicated multipliers for high-speed arithmetic operations. The FBGA package provides excellent thermal dissipation, crucial for high-performance applications. It requires a specific voltage supply for operation and adheres to industry standard JEDEC specifications.

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Pricing & Ordering

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1+ $1,040.0000 $1,040.0000
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Availability: 26 pieces
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