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XC7K325T-L2FBG676I

Name: XC7K325T-L2FBG676I
Brand: Xilinx Inc.
SKU: 1318135
Availability: InStock
Rating: 4.85 (5 reviews)

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This model is a standard, industry-grade component frequently used in electronic manufacturing.

Part No	XC7K325T-L2FBG676I
Manufacturer	Xilinx Inc.
Catalog	Embedded - FPGAs (Field Programmable Gate Array)
Description	IC FPGA 400 I/O 676FCBGA / Kintex®-7 Field Programmable Gate Array (FPGA) IC 400 16404480 326080 676-BBGA, FCBGA
Sample
Rohs State
ECAD Module
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Products specifications Report Issue?

Category	Integrated Circuits (ICs)>Embedded>FPGAs (Field Programmable Gate Array)
Manufacturer	AMD Xilinx
Packaging	Tray
Number of LABs/CLBs	25475
Number of Logic Elements/Cells	326080
Total RAM Bits	16404480
Number of I/O	400
Voltage - Supply	0.97V ~ 1.03V
Mounting	Surface Mount
Temperature Range - Operating	-40°C ~ 100°C (TJ)
Case / Package	676-BBGA, FCBGA
Supplier Device Package	676-FCBGA (27x27)
Base Product Number	XC7K325
RoHS Status	ROHS3 Compliant
MSL Level	4 (72 Hours)
REACH Status	REACH Unaffected
ECCN	3A991D
HTSUS	8542.39.0001
Standard Package	1
Win Source Part Number	1318135-XC7K325T-L2FBG676I
Ultra Librarian 3D Model	Ultra Librarian XC7K325T-L2FBG676I CAD Model

Alternative Products

Description

The AMD Xilinx XC7K325T-L2FBG676I is a field-programmable gate array (FPGA) integrated circuit designed for embedded applications.

LABs/CLBs: 25475
Logic Elements/Cells: 326080
RAM Size: 16404480 bits
Voltage Supply: 0.97V to 1.03V
Temperature: -40°C to 100°C
Package: 676-FCBGA (27x27)
ROHS3: compliant
Application: aerospace and defense systems, industrial automation, and medical equipment

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