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Same model may have multiple batches, images only for reference.
XCKU3P-1FFVD900I Real Image
Same model may have multiple batches, images only for reference.

XCKU3P-1FFVD900I

Part No XCKU3P-1FFVD900I
Manufacturer Xilinx Inc.
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 304 I/O 900FCBGA / Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC 304 31641600 355950 900-BBGA, FCBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs)>Embedded>FPGAs (Field Programmable Gate Array)
Manufacturer AMD Xilinx
Packaging Tray
Number of LABs/CLBs 20340
Number of Logic Elements/Cells 355950
Total RAM Bits 31641600
Number of I/O 304
Voltage - Supply 0.825V ~ 0.876V
Mounting Surface Mount
Temperature Range - Operating -40°C ~ 100°C (TJ)
Case / Package 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
Base Product Number XCKU3
RoHS Status ROHS3 Compliant
MSL Level 4 (72 Hours)
ECCN 3A991D
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 1318078-XCKU3P-1FFVD900I
Ultra Librarian 3D Model Ultra Librarian XCKU3P-1FFVD900I CAD Model

Description

The AMD Xilinx XCKU3P-1FFVD900I is a field-programmable gate array (FPGA) with 304 input/output pins, 20340 LABs/CLBs, and 355950 logic elements/cells.

  • Input/Output Pins: 304
  • LABs/CLBs: 20340
  • Logic Elements/Cells: 355950
  • Total RAM Bits: 31641600
  • Supply Voltage: 0.825V to 0.876V
  • Operating Temperature: -40°C to 100°C (TJ)
  • Mounting Type: Surface Mount
  • Package: 900-FCBGA (31x31)
  • Popular Choice For: Applications that require high-speed processing and low power consumption.
  • RoHS3 Standards: Compliant
  • ECCN: 3A991D

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2+ $252.2389 $504.4778
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