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Same model may have multiple batches, images only for reference.
XCKU3P-1SFVB784I Real Image
Same model may have multiple batches, images only for reference.

XCKU3P-1SFVB784I

Part No XCKU3P-1SFVB784I
Manufacturer Xilinx Inc.
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 256 I/O 784FCBGA / Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC 256 31641600 355950 784-BFBGA, FCBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs)>Embedded>FPGAs (Field Programmable Gate Array)
Manufacturer AMD Xilinx
Packaging Tray
Number of LABs/CLBs 20340
Number of Logic Elements/Cells 355950
Total RAM Bits 31641600
Number of I/O 256
Voltage - Supply 0.825V ~ 0.876V
Mounting Surface Mount
Temperature Range - Operating -40°C ~ 100°C (TJ)
Case / Package 784-BFBGA, FCBGA
Supplier Device Package 784-FCBGA (23x23)
Base Product Number XCKU3
RoHS Status ROHS3 Compliant
MSL Level 4 (72 Hours)
ECCN 3A991D
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 1318206-XCKU3P-1SFVB784I
Ultra Librarian 3D Model Ultra Librarian XCKU3P-1SFVB784I CAD Model

Description

The AMD Xilinx 1318206-XCKU3P-1SFVB784I is an FPGA integrated circuit with 256 I/O and 20340 LABs/CLBs.

  • Logic Elements/Cells: 355950
  • RAM Bits: 31641600
  • Voltage Range: 0.825V to 0.876V
  • Mounting Type: Surface Mountable
  • Package: 784-FCBGA (23x23)
  • Operating Temperature: -40°C to 100°C (TJ)
  • ROHS Compliance: ROHS3 compliant
  • ECCN: 3A991D
  • MSL Level: 4 (72 hours)
  • Packaging: Tray

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