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Same model may have multiple batches, images only for reference.
XC7Z030-1FFG676C Real Image
Same model may have multiple batches, images only for reference.

XC7Z030-1FFG676C

Part No XC7Z030-1FFG676C
Manufacturer Amd
Catalog Embedded - System On Chip (SoC)
Description IC SOC CORTEX-A9 667MHZ 676FCBGA  /  Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC series Kintex™-7 FPGA, 125K Logic Cells 667MHz 676-FCBGA (27x27)
Sample
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ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Mfr AMD Xilinx
Series Zynq®-7000
Package Tray
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 667MHz
Primary Attributes Kintex™-7 FPGA, 125K Logic Cells
Temperature Range - Operating 0°C ~ 85°C (TJ)
Package / Case 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27)
Number of I/O 130
Base Product Number XC7Z030
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Other Names 122-1891
Standard Package 1
Win Source Part Number 1010822-XC7Z030-1FFG676C
Ultra Librarian 3D Model Ultra Librarian XC7Z030-1FFG676C CAD Model

Description

The XC7Z030-1FFG676C is an integrated circuit belonging to the category of embedded system on chip (SoC).

  • Manufacturer: AMD Xilinx
  • Series: Zynq-7000
  • Core: Dual ARM Cortex-A9 MPCore with CoreSight
  • Speed: 667MHz
  • Package: Tray
  • Standard Package: 1
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Peripheral: DMA
  • I/O: 130
  • RAM Size: 256KB
  • Flash Size: -
  • Architecture: MCU and FPGA
  • Attributes: Kintex-7 FPGA, 125K logic cells
  • Package/Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
  • Operating Temperature: 0°C to 85°C (TJ)
  • ECCN: 3A991D
  • REACH: Unaffected
  • HTSUS: 8542.39.0001

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